Inventor · disambiguated record

Kwang Yong Chung

Also filed as: CHUNG KWANG YONG

1 granted patent·3 citations·filing 2005–2005

22Inventor score

Technology areasH10W

Files withSTATS CHIPPAC LTD1

Top patents by PatentIndex Score

1 record

0158US7443018B2Integrated circuit package system including ribbon bond interconnectSTATS CHIPPAC LTD·Filed 2005·Granted Oct 28, 2008·3 cites·20 claims

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