Inventor · disambiguated record
Keizou Hirai
Also filed as: HIRAI KEIZOU
3 granted patents·1 pending application·49 citations·filing 2000–2009
73Inventor score
Top patents by PatentIndex Score
4 records- 0188US8002860B2CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasiveHITACHI CHEMICAL CO LTD·Filed 2009·Granted Aug 23, 2011·12 cites·25 claims
- 0285US6615499B1Method for producing cerium oxide, cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Sep 9, 2003·28 cites·3 claims
- 0366US7410409B1Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compoundHITACHI CHEMICAL CO LTD·Filed 2000·Granted Aug 12, 2008·9 cites·19 claims
- 0447US2007169421A1CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasiveKOYAMA NAOYUKI·Filed 2007·Application pending·0 cites
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