Inventor · disambiguated record
Uri Cohen
Also filed as: COHEN URI · COHEN URI SASSON
54 granted patents·5 pending applications·1,604 citations·filing 1975–2016
99Inventor score
Files withCOHEN URI27SEAGATE TECHNOLOGY10ROTEM AMFERT NEGEV LTD2TOROHEAD INC2BELL TELEPHONE LABOR INC1
Top patents by PatentIndex Score
59 records- 0197US7199052B2Seed layers for metallic interconnectsCOHEN URI·Filed 2005·Granted Apr 3, 2007·34 cites·75 claims
- 0297US6903016B2Combined conformal/non-conformal seed layers for metallic interconnectsFiled 2003·Granted Jun 7, 2005·90 cites·27 claims
- 0397US5421987APrecision high rate electroplating cell and methodFiled 1993·Granted Jun 6, 1995·282 cites·28 claims
- 0495US5059278ASelective chemical removal of coil seed-layer in thin film head magnetic transducerSEAGATE TECHNOLOGY·Filed 1990·Granted Oct 22, 1991·102 cites·26 claims
- 0593US6518668B2Multiple seed layers for metallic interconnectsFiled 2000·Granted Feb 11, 2003·52 cites·60 claims
- 0693US6136707ASeed layers for interconnects and methods for fabricating such seed layersFiled 1999·Granted Oct 24, 2000·150 cites·38 claims
- 0793US5995342AThin film heads having solenoid coilsTOROHEAD INC·Filed 1997·Granted Nov 30, 1999·93 cites·36 claims
- 0893US5703740AToroidal thin film headVELOCIDATA INC·Filed 1996·Granted Dec 30, 1997·84 cites·51 claims
- 0993US5141623AMethod for aligning pole tips in a thin film headSEAGATE TECHNOLOGY·Filed 1990·Granted Aug 25, 1992·65 cites·30 claims
- 1092US6610151B1Seed layers for interconnects and methods and apparatus for their fabricationFiled 2000·Granted Aug 26, 2003·45 cites·40 claims
- 1189US6195232B1Low-noise toroidal thin film head with solenoidal coilTOROHEAD INC·Filed 1997·Granted Feb 27, 2001·63 cites·40 claims
- 1288US6869515B2Enhanced electrochemical deposition (ECD) filling of high aspect ratio openingsFiled 2002·Granted Mar 22, 2005·25 cites·38 claims
- 1388US4923574AMethod for making a record member with a metallic antifriction overcoatCOHEN URI·Filed 1989·Granted May 8, 1990·33 cites·40 claims
- 1487US8603242B2Floating semiconductor foilsCOHEN URI·Filed 2010·Granted Dec 10, 2013·3 cites·29 claims
- 1587US7105434B2Advanced seed layery for metallic interconnectsCOHEN URI·Filed 2004·Granted Sep 12, 2006·23 cites·21 claims
- 1686US7709958B2Methods and structures for interconnect passivationCOHEN URI·Filed 2005·Granted May 4, 2010·12 cites·14 claims
- 1786US6635184B1Method for pattern-etching alumina layers and productsCOHEN URI·Filed 2000·Granted Oct 21, 2003·28 cites·59 claims
- 1886US5673163APinched-gap magnetic recording thin film headFiled 1994·Granted Sep 30, 1997·39 cites·21 claims
- 1986US5326429AProcess for making studless thin film magnetic headSEAGATE TECHNOLOGY·Filed 1992·Granted Jul 5, 1994·38 cites·54 claims
- 2085US9161272B2Method and apparatus to achieve lossless call in view of a temporary reception issueMOTOROLA SOLUTIONS INC·Filed 2013·Granted Oct 13, 2015·9 cites·17 claims
- 2184US6924226B2Methods for making multiple seed layers for metallic interconnectsFiled 2002·Granted Aug 2, 2005·36 cites·80 claims
- 2283US7682496B2Apparatus for depositing seed layersCOHEN URI·Filed 2006·Granted Mar 23, 2010·5 cites·14 claims
- 2382US7282445B2Multiple seed layers for interconnectsCOHEN URI·Filed 2007·Granted Oct 16, 2007·6 cites·22 claims
- 2482US3983012AEpitaxial growth of silicon or germanium by electrodeposition from molten saltsUNIV LELAND STANFORD JUNIOR·Filed 1975·Granted Sep 28, 1976·23 cites·14 claims
- 2581US5621595APinched-gap magnetic recording thin film headFiled 1992·Granted Apr 15, 1997·24 cites·29 claims
- 2679US8685221B1Enhanced electrochemical deposition fillingCOHEN URI·Filed 2012·Granted Apr 1, 2014·2 cites·36 claims
- 2778US5820770AThin film magnetic head including vias formed in alumina layer and process for making the sameSEAGATE TECHNOLOGY·Filed 1995·Granted Oct 13, 1998·39 cites·71 claims
- 2876US6059984AProcess for fabricating thin film magnetic head including crater for recessed structureSEAGATE TECHNOLOGY·Filed 1996·Granted May 9, 2000·37 cites·28 claims
- 2976US5200056AMethod for aligning pole tips in a thin film headSEAGATE TECHNOLOGY·Filed 1992·Granted Apr 6, 1993·34 cites·1 claims
- 3070US8123861B2Apparatus for making interconnect seed layers and productsCOHEN URI·Filed 2010·Granted Feb 28, 2012·1 cites·28 claims
- 3167US5657192AThin film magnetic head including crater for recessed structure and process for making the sameSEAGATE TECHNOLOGY·Filed 1995·Granted Aug 12, 1997·14 cites·19 claims
- 3266US9911614B2Methods for activating openings for jets electroplatingCOHEN URI·Filed 2010·Granted Mar 6, 2018·1 cites·15 claims
- 3362US5659451AStudless thin film magnetic head and process for making the sameSEAGATE TECHNOLOGY·Filed 1995·Granted Aug 19, 1997·11 cites·31 claims
- 3461US9278890B2Continuous process for manufacturing freely flowing solid acidic P/K fertilizerROTEM AMFERT NEGEV LTD·Filed 2013·Granted Mar 8, 2016·1 cites·12 claims
- 3560US2014197537A1Void-Free Metallic Filled High Aspect Ratio OpeningsCOHEN URI·Filed 2014·Application pending·0 cites
- 3659US9530653B2High speed electroplating metallic conductorsCOHEN URI·Filed 2016·Granted Dec 27, 2016·0 cites·34 claims
- 3759US5835315AWafer including scribe line grooves for separating thin film heads and process for making the sameSEAGATE TECHNOLOGY·Filed 1995·Granted Nov 10, 1998·11 cites·14 claims
- 3859US5745980AMethod of fabricating magnetic recording thin film head having pinched-gapFiled 1995·Granted May 5, 1998·10 cites·19 claims
- 3959US5650897AThin film magnetic head including lightning arrester and process for making the sameSEAGATE TECHNOLOGY·Filed 1996·Granted Jul 22, 1997·17 cites·33 claims
- 4059US4269671AElectroplating of silver-palladium alloys and resulting productBELL TELEPHONE LABOR INC·Filed 1979·Granted May 26, 1981·15 cites·13 claims
- 4159US2014061919A1Electroplated Metallic Interconnects And ProductsCOHEN URI·Filed 2013·Application pending·0 cites
- 4258US9273409B2Electroplated metallic conductorsCOHEN URI·Filed 2015·Granted Mar 1, 2016·0 cites·27 claims
- 4357US10096547B2Metallic interconnects productsCOHEN URI·Filed 2015·Granted Oct 9, 2018·0 cites·29 claims
- 4457US9673090B2Seed layers for metallic interconnectsCOHEN URI·Filed 2009·Granted Jun 6, 2017·0 cites·4 claims
- 4557US8349149B2Apparatus for enhanced electrochemical depositionCOHEN URI·Filed 2007·Granted Jan 8, 2013·0 cites·36 claims
- 4657US5945007AMethod for etching gap-vias in a magnetic thin film head and productFiled 1998·Granted Aug 31, 1999·10 cites·23 claims
- 4756US8586471B2Seed layers for metallic interconnects and productsCOHEN URI·Filed 2012·Granted Nov 19, 2013·0 cites·28 claims
- 4854US7573133B2Interconnect structures and methods for their fabricationCOHEN URI·Filed 2004·Granted Aug 11, 2009·5 cites·20 claims
- 4954US7550386B2Advanced seed layers for interconnectsCOHEN URI·Filed 2007·Granted Jun 23, 2009·0 cites·6 claims
- 5052US7247563B2Filling high aspect ratio openings by enhanced electrochemical deposition (ECD)COHEN URI·Filed 2005·Granted Jul 24, 2007·0 cites·33 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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