Inventor · disambiguated record
Harjashan Veer Singh
Also filed as: SINGH HARJASHAN · SINGH HARJASHAN VEER
3 granted patents·3 pending applications·5 citations·filing 2018–2024
55Inventor score
Top patents by PatentIndex Score
6 records- 0181US10483239B2Semiconductor device including dual pad wire bond interconnectionSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2018·Granted Nov 19, 2019·5 cites·22 claims
- 0256US12482781B2Substrates with spacers, including substrates with solder resist spacers, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 0355US2025154378A1Die attach adhesives with tailorable characteristics using selectively releasable additivesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0452US12412771B2Methods of detecting process deviations during microelectronic device fabrication and associated tapes and componentsMICRON TECHNOLOGY INC·Filed 2022·Granted Sep 9, 2025·0 cites·24 claims
- 0550US2024222183A1Crosslinking a back grinding tape for a semiconductor waferMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 0645US2024079358A1Systems and methods for reducing die slip during group bondingMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →