Inventor · disambiguated record
Yuan-Hung Lin
Also filed as: LIN YUAN-HUNG
11 granted patents·5 pending applications·11 citations·filing 2013–2024
80Inventor score
Top patents by PatentIndex Score
16 records- 0185US9147680B2Integrated circuits having replacement metal gates with improved threshold voltage performance and methods for fabricating the sameGLOBALFOUNDRIES INC·Filed 2013·Granted Sep 29, 2015·10 cites·19 claims
- 0267US10736209B2Circuit board structure and conductive transmission line structure thereofGLOBAL UNICHIP CORP·Filed 2019·Granted Aug 4, 2020·1 cites·10 claims
- 0358US2025273583A1Interposer device and semiconductor package deviceGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0457US2025105163A1Semiconductor chiplet device and interposerGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0556US2025349695A1Substrate structure and semiconductor packageGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0656US2025385191A1Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0755US2025226330A1Semiconductor package device and semiconductor wiring substrate thereofGLOBAL UNICHIP CORP·Filed 2024·Application pending·0 cites
- 0853US12066968B2Communication interface structure and Die-to-Die packageGLOBAL UNICHIP CORP·Filed 2022·Granted Aug 20, 2024·0 cites·18 claims
- 0951US12230578B2Semiconductor chiplet deviceGLOBAL UNICHIP CORP·Filed 2022·Granted Feb 18, 2025·0 cites·13 claims
- 1050US11739642B2Manufacturing method of 3-dimensional plastic impeller of centrifugal pump and the impellerASSOMA INC·Filed 2019·Granted Aug 29, 2023·0 cites·13 claims
- 1148US11742295B2Interface of integrated circuit die and method for arranging interface thereofGLOBAL UNICHIP CORP·Filed 2020·Granted Aug 29, 2023·0 cites·18 claims
- 1246US11309936B2Signal transmission deviceGLOBAL UNICHIP CORP·Filed 2020·Granted Apr 19, 2022·0 cites·10 claims
- 1345US10892238B2Circuit structure and chip packageGLOBAL UNICHIP CORP·Filed 2019·Granted Jan 12, 2021·0 cites·18 claims
- 1443US11335631B2Power delivery device and methodGLOBAL UNICHIP CORP·Filed 2020·Granted May 17, 2022·0 cites·9 claims
- 1538US10790223B2Integrated circuit package element and load board thereofGLOBAL UNICHIP CORP·Filed 2019·Granted Sep 29, 2020·0 cites·10 claims
- 1637US9401650B2Power supply apparatus3Y POWER TECH (TAIWAN) INC·Filed 2013·Granted Jul 26, 2016·0 cites·19 claims
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