Inventor · disambiguated record
Lawrence Greenberg
Also filed as: GREENBERG LAWRENCE · GREENBERG LAWRENCE A · GREENBERG LAWRENCE ARNOLD
10 granted patents·402 citations·filing 1979–2008
92Inventor score
Files withLUCENT TECHNOLOGIES INC3AMERICAN CASH EXCHANGE INC2AMERICAN TELEPHONE & TELEGRAPH2AMERICAN CASH EXCHANGE L L C1AT & T BELL LAB1
Top patents by PatentIndex Score
10 records- 0195US4717066AMethod of bonding conductors to semiconductor devicesAMERICAN TELEPHONE & TELEGRAPH·Filed 1986·Granted Jan 5, 1988·138 cites·8 claims
- 0285US6074897AIntegrated circuit bonding method and apparatusLUCENT TECHNOLOGIES INC·Filed 1999·Granted Jun 13, 2000·79 cites·11 claims
- 0382US7195151B2Method and system for automated value transferAMERICAN CASH EXCHANGE INC·Filed 2003·Granted Mar 27, 2007·38 cites·13 claims
- 0477US8038058B2Method and system for automated value transferAMERICAN CASH EXCHANGE INC·Filed 2008·Granted Oct 18, 2011·7 cites·7 claims
- 0576US5100507AFinishing techniques for lensed optical fibersAT & T BELL LAB·Filed 1991·Granted Mar 31, 1992·55 cites·16 claims
- 0675US7416115B2Method and system for automated value transferAMERICAN CASH EXCHANGE L L C·Filed 2005·Granted Aug 26, 2008·9 cites·10 claims
- 0770US4774635ASemiconductor package with high density I/O lead connectionAMERICAN TELEPHONE & TELEGRAPH·Filed 1986·Granted Sep 27, 1988·40 cites·10 claims
- 0859US6140710APower and ground and signal layout for higher density integrated circuit connections with flip-chip bondingLUCENT TECHNOLOGIES INC·Filed 1999·Granted Oct 31, 2000·25 cites·12 claims
- 0937USRE36894ESemiconductor package with high density I/O lead connectionLUCENT TECHNOLOGIES INC·Filed 1994·Granted Oct 3, 2000·10 cites·12 claims
- 1035US4279400AHot top for ingot moldBETHLEHEM STEEL CORP·Filed 1979·Granted Jul 21, 1981·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →