Inventor · disambiguated record
Oscar Torrents Abad
Also filed as: ABAD OSCAR TORRENTS
11 granted patents·1 pending application·12 citations·filing 2017–2022
84Inventor score
Top patents by PatentIndex Score
12 records- 0191US10840418B1Fabricating parabolic-shaped LEDsFACEBOOK TECH LLC·Filed 2019·Granted Nov 17, 2020·6 cites·20 claims
- 0287US11374148B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2020·Granted Jun 28, 2022·2 cites·10 claims
- 0381US11563142B2Curing pre-applied and plasma-etched underfill via a laserFACEBOOK TECH LLC·Filed 2020·Granted Jan 24, 2023·1 cites·20 claims
- 0479US10269781B1Elastomeric layer fabrication for light emitting diodesFACEBOOK TECH LLC·Filed 2018·Granted Apr 23, 2019·2 cites·20 claims
- 0578US11677051B1Application of underfill via centrifugal forceMETA PLATFORMS TECH LLC·Filed 2020·Granted Jun 13, 2023·1 cites·10 claims
- 0677US11735689B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 0777US2022393060A1Curing pre-applied and laser-ablated underfill via a laserFACEBOOK TECH LLC·Filed 2022·Application pending·0 cites
- 0870US11557692B2Selectively bonding light-emitting devices via a pulsed laserFACEBOOK TECH LLC·Filed 2020·Granted Jan 17, 2023·0 cites·24 claims
- 0969US11575069B2Employing deformable contacts and pre-applied underfill for bonding LED devices via lasersFACEBOOK TECH LLC·Filed 2020·Granted Feb 7, 2023·0 cites·11 claims
- 1055US10319705B2Elastomeric layer fabrication for light emitting diodesFACEBOOK TECH LLC·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
- 1147US11404600B2Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasersFACEBOOK TECH LLC·Filed 2020·Granted Aug 2, 2022·0 cites·13 claims
- 1246US10388516B1Method for polymer-assisted chip transferFACEBOOK TECH LLC·Filed 2018·Granted Aug 20, 2019·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →