Inventor · disambiguated record
Sheng-Lin Ma
Also filed as: MA SHENG · Ma sheng-lin
7 granted patents·1 pending application·6 citations·filing 2018–2022
72Inventor score
Files withJ METRICS TECH CO LTD6RUGAO HONGMAO HEAVY DUTY FORGING CO LTD1SONICMEMS ZHENGZHOU TECH CO LTD1
Top patents by PatentIndex Score
8 records- 0190US11075072B2Wafer scale ultrasonic sensing device and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2020·Granted Jul 27, 2021·3 cites·11 claims
- 0282US11460341B2Wafer scale ultrasonic sensor assembly and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2019·Granted Oct 4, 2022·3 cites·20 claims
- 0365US2023014827A1Wafer level ultrasonic chip module having suspension structureJ METRICS TECH CO LTD·Filed 2022·Application pending·0 cites
- 0454US10657349B2Ultrasonic module and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2018·Granted May 19, 2020·0 cites·16 claims
- 0551US11478822B2Wafer level ultrasonic chip module having suspension structure and manufacturing method thereofJ METRICS TECH CO LTD·Filed 2019·Granted Oct 25, 2022·0 cites·7 claims
- 0647US11130674B2Integrated package structure for MEMS element and ASIC chip and method for manufacturing the sameJ METRICS TECH CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·9 claims
- 0746US11608550B2Hot working die steel with high thermal strength and high toughness and manufacturing process thereofRUGAO HONGMAO HEAVY DUTY FORGING CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·8 claims
- 0836US11590536B2Wafer level ultrasonic chip module and manufacturing method thereofSONICMEMS ZHENGZHOU TECH CO LTD·Filed 2019·Granted Feb 28, 2023·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →