Inventor · disambiguated record
Seok Hyun Lee
Also filed as: LEE SEOK · LEE SEOK HYUN
28 granted patents·10 pending applications·51 citations·filing 1998–2024
94Inventor score
Files withSAMSUNG ELECTRONICS CO LTD26DONGJIN SEMICHEM CO LTD3LEE SEOK HYUN2LG DISPLAY CO LTD2HYUNDAI MOTOR CO LTD1
Top patents by PatentIndex Score
38 records- 0195US10847468B2Semiconductor package including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 24, 2020·9 cites·20 claims
- 0292US11710701B2Semiconductor package including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 25, 2023·1 cites·20 claims
- 0390US11904492B2Strip cutting device for diagnostic kitLEE SEOKHYUN·Filed 2021·Granted Feb 20, 2024·2 cites·4 claims
- 0490US11758284B2Image processors and image processing methodsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 12, 2023·2 cites·12 claims
- 0588US2025070032A1Semiconductor package including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0686US11652090B2Semiconductor package and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 16, 2023·2 cites·20 claims
- 0786US9431374B2Semiconductor packageLEE BAIK-WOO·Filed 2015·Granted Aug 30, 2016·6 cites·19 claims
- 0885US10622320B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·4 cites·9 claims
- 0984US12170249B2Semiconductor package including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 1084US10047851B2Lubricating apparatus for differential unit of vehicleHYUNDAI MOTOR CO LTD·Filed 2016·Granted Aug 14, 2018·4 cites·8 claims
- 1182US11025816B2Image processors and image processing methodsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 1, 2021·3 cites·20 claims
- 1282US9508657B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 29, 2016·4 cites·13 claims
- 1379US11069721B2Display device and method of manufacturing the sameLG DISPLAY CO LTD·Filed 2019·Granted Jul 20, 2021·3 cites·20 claims
- 1477US12052513B2Image processors and image processing methodsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 1575US10230933B2Processing three-dimensional (3D) image through selectively processing stereoscopic imagesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 12, 2019·2 cites·16 claims
- 1674US11355440B2Semiconductor package including interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 1770US9929022B2Semiconductor chip package and method of manufacturing the sameLEE SEOK HYUN·Filed 2016·Granted Mar 27, 2018·2 cites·20 claims
- 1869US11715645B2Method for fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 1, 2023·0 cites·20 claims
- 1967US11839110B2Organic light-emitting display deviceLG DISPLAY CO LTD·Filed 2019·Granted Dec 5, 2023·1 cites·17 claims
- 2062US11791286B2Semiconductor device and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 2162US2024201590A1Positive photosensitive resin composition and display device comprising sameDONGJIN SEMICHEM CO LTD·Filed 2024·Application pending·0 cites
- 2261US11462464B2Fan-out semiconductor package having redistribution line structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 2361US11322368B2Method for fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 2461US2024004292A1Positive photoresist resin composition and insulating film and display device based thereonDONGJIN SEMICHEM CO LTD·Filed 2023·Application pending·0 cites
- 2559US11101231B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·20 claims
- 2659US2024222299A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2758US2023205085A1Positive photosensitive resin compositionDONGJIN SEMICHEM CO LTD·Filed 2023·Application pending·0 cites
- 2856US10879163B2Fan-out semiconductor package having redistribution line structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
- 2955US2024055337A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3051US2023068587A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3150US12390948B2Device for cutting diagnostic reagent paper into stripLEE SEOK HYUN·Filed 2021·Granted Aug 19, 2025·0 cites·8 claims
- 3247US12025286B2Lamp for vehicleSL CORP·Filed 2023·Granted Jul 2, 2024·0 cites·17 claims
- 3346US8927340B2Double-sided adhesive tape, semiconductor packages, and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·0 cites·16 claims
- 3446US2018076151A1Semiconductor device and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 3544US6194831B1Gas discharge displayLG ELECTRONICS INC·Filed 1998·Granted Feb 27, 2001·6 cites·12 claims
- 3643US9093439B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 28, 2015·0 cites·19 claims
- 3742US2013292846A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 3833US2016064365A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →