Inventor · disambiguated record
Reimund Engl
Also filed as: ENGL REIMUND
18 granted patents·8 pending applications·58 citations·filing 2004–2020
92Inventor score
Top patents by PatentIndex Score
26 records- 0189US7868465B2Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrierINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 11, 2011·18 cites·15 claims
- 0280US10978418B2Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layerINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 0378US10461056B2Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·2 cites·7 claims
- 0474US8330252B2Integrated circuit device and method for the production thereofMAHLER JOACHIM·Filed 2007·Granted Dec 11, 2012·7 cites·20 claims
- 0574US7675146B2Semiconductor device with leadframe including a diffusion barrierINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 9, 2010·6 cites·21 claims
- 0674US7211856B2Resistive memory for low-voltage applicationsINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 1, 2007·4 cites·23 claims
- 0772US7238964B2Memory cell, method for the production thereof and use of a composition thereforINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 3, 2007·4 cites·21 claims
- 0871US7955901B2Method for producing a power semiconductor module comprising surface-mountable flat external contactsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 7, 2011·6 cites·25 claims
- 0970US8835319B2Protection layers for conductive pads and methods of formation thereofMEINHOLD DIRK·Filed 2012·Granted Sep 16, 2014·3 cites·34 claims
- 1068US12033972B2Chip package, method of forming a chip package and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 9, 2024·0 cites·12 claims
- 1165US8110906B2Semiconductor device including isolation layerMAHLER JOACHIM·Filed 2007·Granted Feb 7, 2012·2 cites·14 claims
- 1260US7417247B2Pentaarylcyclopentadienyl units as active units in resistive memory elementsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 26, 2008·4 cites·15 claims
- 1350US9059083B2Semiconductor deviceEWE HENRIK·Filed 2007·Granted Jun 16, 2015·0 cites·10 claims
- 1448US8642408B2Semiconductor deviceOTREMBA RALF·Filed 2010·Granted Feb 4, 2014·0 cites·24 claims
- 1548US2014319688A1Protection Layers for Conductive Pads and Methods of Formation ThereofINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 1646US7705441B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 27, 2010·0 cites·40 claims
- 1745US10672678B2Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 1845US9941181B2Chip package and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 10, 2018·0 cites·13 claims
- 1945US2015279782A1Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
- 2044US2007164276A1Method for Forming Memory LayersQIMONDA AG·Filed 2007·Application pending·0 cites
- 2142US2008191197A1Semiconductor Arrangement Having a Resistive MemoryQIMONDA AG·Filed 2005·Application pending·0 cites
- 2242US2008061449A1Semiconductor Component ArrangementINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 2340US2006237716A1Material and cell structure for storage applicationsSEZI RECAI·Filed 2006·Application pending·0 cites
- 2439US10497634B2Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compoundINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 3, 2019·0 cites·12 claims
- 2539US2007194301A1Semiconductor arrangement with non-volatile memoriesSEZI RECAI·Filed 2004·Application pending·0 cites
- 2633US2008142774A1Integrated Circuit Having Resistive MemoryQIMONDA AG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →