Inventor · disambiguated record

Kevin Hsia

Also filed as: HSIA KEVIN

1 granted patent·1 pending application·50 citations·filing 2001–2001

48Inventor score

Technology areasH10W

Files withWALSIN ADVANCED ELECTRONICS2

Top patents by PatentIndex Score

2 records

0181US6521485B2Method for manufacturing wafer level chip size packageWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Feb 18, 2003·50 cites·6 claims
0229US2002094683A1Method for manufacturing chip size package and its structureWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →