Inventor · disambiguated record
Chao-Sen Chang
Also filed as: CHANG CHAO-SEN
23 granted patents·11 pending applications·69 citations·filing 2004–2024
93Inventor score
Files withMERRY ELECTRONICS SHENZHEN CO LTD25MERRY ELECTRONICS CO LTD3DELTA ELECTRONICS INC2CHEN JEN-YI1MERRY ELECTRONICS (SUZHOU) CO LTD1
Top patents by PatentIndex Score
34 records- 0193US9162869B1MEMS microphone package structure having non-planar substrate and method of manufacturing sameMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Granted Oct 20, 2015·16 cites·2 claims
- 0291US10972844B1Earphone and set of earphonesMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2020·Granted Apr 6, 2021·9 cites·20 claims
- 0385US9036838B2Dual-diaphragm acoustic transducerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2013·Granted May 19, 2015·9 cites·7 claims
- 0482US9369808B2Acoustic transducer with high sensitivityMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2013·Granted Jun 14, 2016·7 cites·14 claims
- 0582US9193581B1MEMS microphone package structure having an improved carrier and a method of manufacturing sameMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Granted Nov 24, 2015·6 cites·9 claims
- 0681US9799337B2Microphone apparatus for enhancing power conservationMERRY ELECTRONICS(SUZHOU) CO LTD·Filed 2016·Granted Oct 24, 2017·11 cites·10 claims
- 0775US10710868B2MEMS sensorMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2019·Granted Jul 14, 2020·1 cites·15 claims
- 0875US10536780B2Piezoelectric transducerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2018·Granted Jan 14, 2020·3 cites·14 claims
- 0971US7768028B2Light emitting apparatusDELTA ELECTRONICS INC·Filed 2007·Granted Aug 3, 2010·4 cites·12 claims
- 1070US11781901B2Vibration sensor with pressure enhancementMERRY ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·11 claims
- 1168US10638235B2MEMS speakerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2018·Granted Apr 28, 2020·1 cites·17 claims
- 1267US9319772B2Multi-floor type MEMS microphoneMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Granted Apr 19, 2016·2 cites·12 claims
- 1366US11671735B2Microphone moduleMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2022·Granted Jun 6, 2023·0 cites·4 claims
- 1462US11467027B2Vibration sensor for obtaining signals with high signal-to-noise ratioMERRY ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·15 claims
- 1560US11509984B2Microphone moduleMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·9 claims
- 1659US10943870B2Microphone package structureMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·12 claims
- 1756US11619544B2Vibration sensor having vent for pressure enhancing memberMERRY ELECTRONICS CO LTD·Filed 2021·Granted Apr 4, 2023·0 cites·10 claims
- 1856US2025358567A1Microphone moduleMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 1954US2025358560A1Microphone moduleMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 2053US10972840B2SpeakerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·18 claims
- 2151US11800298B2Micro-electro mechanical device with vibration sensor and micro-electro mechanical microphoneMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·12 claims
- 2251US2007062555A1Ultrasonic cleaning system and methodDELTA ELECTRONICS INC·Filed 2006·Application pending·0 cites
- 2351US2017257708A1Acoustic transducerMERRY ELECTRONICS(SHENZHEN) CO LTD·Filed 2017·Application pending·0 cites
- 2451US2015109889A1Acoustic transducer with membrane supporting structureMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2013·Application pending·0 cites
- 2550US2020266151A1Electronic package structureMERRY ELECTRONICS (SHENZHEN) CO LTD·Filed 2019·Application pending·0 cites
- 2649US11561129B2Vibration sensing assembly for bone conduction microphoneMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2021·Granted Jan 24, 2023·0 cites·19 claims
- 2746US10072999B2Air pressure sensing systemMERRY ELECTRONICS SUZHOU CO·Filed 2016·Granted Sep 11, 2018·0 cites·15 claims
- 2844US2015304751A1Chip-stacked microphoneMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Application pending·0 cites
- 2943US2017064458A1Mems microphone package structure having a non-planar substrateCHEN JEN-YI·Filed 2015·Application pending·0 cites
- 3041US2018146302A1Mems microphone package structure and method for manufacturing the mems microphone package structuresMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2017·Application pending·0 cites
- 3140US2020322731A1Acoustic transducerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2020·Application pending·0 cites
- 3239US9656853B2MEMS chip packageMERRY ELECTRONICS(SHENZHEN) CO LTD·Filed 2015·Granted May 23, 2017·0 cites·11 claims
- 3339US7605970B2External cavity tunable laser system formed from MEMS corner mirrorWALSIN LIHWA CORP·Filed 2004·Granted Oct 20, 2009·0 cites·20 claims
- 3433US2017057808A1Mems chip package and method for manufacturing the sameMERRY ELECTRONICS(SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →