Inventor · disambiguated record
Jen-Yi Chen
Also filed as: CHEN JEN-YI
37 granted patents·9 pending applications·133 citations·filing 2004–2023
96Inventor score
Files withMERRY ELECTRONICS SHENZHEN CO LTD23IND TECH RES INST6MERRY ELECTRONICS CO LTD6CHEN JEN-YI4NAT UNIV TSING HUA2
Top patents by PatentIndex Score
46 records- 0193US9162869B1MEMS microphone package structure having non-planar substrate and method of manufacturing sameMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Granted Oct 20, 2015·16 cites·2 claims
- 0293US7902843B2SensorIND TECH RES INST·Filed 2008·Granted Mar 8, 2011·30 cites·13 claims
- 0392US8695426B2Micro-electromechanical system device having electrical insulating structure and manufacturing methodsHSU YU WEN·Filed 2011·Granted Apr 15, 2014·9 cites·18 claims
- 0487US7912235B2Capacitive microphone and method for making the sameIND TECH RES INST·Filed 2006·Granted Mar 22, 2011·14 cites·16 claims
- 0585US9036838B2Dual-diaphragm acoustic transducerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2013·Granted May 19, 2015·9 cites·7 claims
- 0684US9319764B2MEMS microphone packaging structureMERRY ELECTRONICS CO LTD·Filed 2013·Granted Apr 19, 2016·7 cites·12 claims
- 0782US9369808B2Acoustic transducer with high sensitivityMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2013·Granted Jun 14, 2016·7 cites·14 claims
- 0882US9193581B1MEMS microphone package structure having an improved carrier and a method of manufacturing sameMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Granted Nov 24, 2015·6 cites·9 claims
- 0980US8586486B2Method for forming semiconductor deviceCHEN JEN-YI·Filed 2011·Granted Nov 19, 2013·6 cites·12 claims
- 1078US8468665B2Methods for making capacitive microphoneCHEN JEN-YI·Filed 2011·Granted Jun 25, 2013·5 cites·16 claims
- 1176US11223908B1Microphone structureMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2020·Granted Jan 11, 2022·1 cites·9 claims
- 1275US10710868B2MEMS sensorMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2019·Granted Jul 14, 2020·1 cites·15 claims
- 1375US10536780B2Piezoelectric transducerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2018·Granted Jan 14, 2020·3 cites·14 claims
- 1473US8039910B2Electro-acoustic sensing deviceIND TECH RES INST·Filed 2007·Granted Oct 18, 2011·6 cites·17 claims
- 1571US7960805B2MEMS structure with suspended microstructure that includes dielectric layer sandwiched by plural metal layers and the dielectric layer having an edge surrounded by peripheral metal wallIND TECH RES INST·Filed 2009·Granted Jun 14, 2011·4 cites·8 claims
- 1670US11781901B2Vibration sensor with pressure enhancementMERRY ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·11 claims
- 1768US10638235B2MEMS speakerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2018·Granted Apr 28, 2020·1 cites·17 claims
- 1867US10609491B1Speaker and MEMs actuator thereofMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2019·Granted Mar 31, 2020·1 cites·15 claims
- 1967US9319772B2Multi-floor type MEMS microphoneMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Granted Apr 19, 2016·2 cites·12 claims
- 2066US11671735B2Microphone moduleMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2022·Granted Jun 6, 2023·0 cites·4 claims
- 2162US11467027B2Vibration sensor for obtaining signals with high signal-to-noise ratioMERRY ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·15 claims
- 2260US11509984B2Microphone moduleMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·9 claims
- 2360US9258662B2Condenser microphone and manufacturing method thereofNAT UNIV TSING HUA·Filed 2014·Granted Feb 9, 2016·1 cites·8 claims
- 2458US12129169B2Semi-finished product of electronic device and electronic deviceMERRY ELECTRONICS CO LTD·Filed 2021·Granted Oct 29, 2024·0 cites·11 claims
- 2558US8900886B2System and method of monitoring and controlling atomic layer deposition of tungstenCHEN KUN-EI·Filed 2012·Granted Dec 2, 2014·1 cites·18 claims
- 2656US11619544B2Vibration sensor having vent for pressure enhancing memberMERRY ELECTRONICS CO LTD·Filed 2021·Granted Apr 4, 2023·0 cites·10 claims
- 2755US9382112B2Manufacturing methods for micro-electromechanical system device having electrical insulating structureIND TECH RES INST·Filed 2014·Granted Jul 5, 2016·0 cites·10 claims
- 2854US8144899B2Acoustic transducer and microphone using the sameSONG PO-HSUN·Filed 2008·Granted Mar 27, 2012·3 cites·20 claims
- 2953US10972840B2SpeakerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·18 claims
- 3052US11930318B2Electronic deviceMERRY ELECTRONICS CO LTD·Filed 2021·Granted Mar 12, 2024·0 cites·19 claims
- 3151US11800298B2Micro-electro mechanical device with vibration sensor and micro-electro mechanical microphoneMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·12 claims
- 3251US2017257708A1Acoustic transducerMERRY ELECTRONICS(SHENZHEN) CO LTD·Filed 2017·Application pending·0 cites
- 3351US2015109889A1Acoustic transducer with membrane supporting structureMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2013·Application pending·0 cites
- 3450US2020266151A1Electronic package structureMERRY ELECTRONICS (SHENZHEN) CO LTD·Filed 2019·Application pending·0 cites
- 3549US11561129B2Vibration sensing assembly for bone conduction microphoneMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2021·Granted Jan 24, 2023·0 cites·19 claims
- 3649US9729990B2Manufacturing method of a condenser microphoneNAT UNIV TSING HUA·Filed 2015·Granted Aug 8, 2017·0 cites·4 claims
- 3746US12431865B2Resonant structure in micro electro mechanical systemsZILLTEK TECHNOLOGY CORP·Filed 2023·Granted Sep 30, 2025·0 cites·11 claims
- 3846US10072999B2Air pressure sensing systemMERRY ELECTRONICS SUZHOU CO·Filed 2016·Granted Sep 11, 2018·0 cites·15 claims
- 3944US2015304751A1Chip-stacked microphoneMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2014·Application pending·0 cites
- 4043US8035402B2SensorIND TECH RES INST·Filed 2011·Granted Oct 11, 2011·0 cites·6 claims
- 4143US2017064458A1Mems microphone package structure having a non-planar substrateCHEN JEN-YI·Filed 2015·Application pending·0 cites
- 4241US2018146302A1Mems microphone package structure and method for manufacturing the mems microphone package structuresMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2017·Application pending·0 cites
- 4340US2020322731A1Acoustic transducerMERRY ELECTRONICS SHENZHEN CO LTD·Filed 2020·Application pending·0 cites
- 4439US9656853B2MEMS chip packageMERRY ELECTRONICS(SHENZHEN) CO LTD·Filed 2015·Granted May 23, 2017·0 cites·11 claims
- 4535US2006001114A1Apparatus and method of wafer level packageCHEN JEN-YI·Filed 2004·Application pending·0 cites
- 4633US2017057808A1Mems chip package and method for manufacturing the sameMERRY ELECTRONICS(SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
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