Inventor · disambiguated record
Hsun-Wei Chan
Also filed as: CHAN HSUN-WEI
29 granted patents·5 pending applications·26 citations·filing 2012–2025
93Inventor score
Top patents by PatentIndex Score
34 records- 0195US11276806B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 15, 2022·4 cites·22 claims
- 0290US10396783B2Optical module, manufacturing method thereof and electronic apparatusADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Aug 27, 2019·10 cites·28 claims
- 0387US2025334402A1Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0485US12352602B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Jul 8, 2025·0 cites·13 claims
- 0578US11835363B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 5, 2023·0 cites·11 claims
- 0675US12094995B2Optical device including lid having first and second cavity with inclined sidewallsADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Sep 17, 2024·0 cites·13 claims
- 0774US10752494B2Semiconductor device packageADVANCED SEMICONDUCTORY ENGINEERING INC·Filed 2018·Granted Aug 25, 2020·1 cites·27 claims
- 0872US10436635B2Active optical component with passive optical component and encapsulant for an optical device and electrical device including the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Oct 8, 2019·2 cites·16 claims
- 0970US10526200B2Semiconductor device package including cover including tilted inner sidewallADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 7, 2020·1 cites·18 claims
- 1068US10069051B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 4, 2018·1 cites·20 claims
- 1168US8637887B2Thermally enhanced semiconductor packages and related methodsCHAN HSUN-WEI·Filed 2012·Granted Jan 28, 2014·3 cites·17 claims
- 1266US11262197B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 1, 2022·0 cites·18 claims
- 1366US10424566B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 24, 2019·1 cites·19 claims
- 1465US10804173B2Lid structure and semiconductor device package including the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Oct 13, 2020·1 cites·5 claims
- 1565US10381294B2Semiconductor package deviceADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Aug 13, 2019·1 cites·26 claims
- 1664US2020140262A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 1763US11776862B2Lid structure and semiconductor device package including the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 3, 2023·0 cites·7 claims
- 1862US10689249B2Semiconductor device package including a wall and a grounding ring exposed from the wallADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jun 23, 2020·1 cites·16 claims
- 1959US2025167131A1Optical package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2058US2024237907A1Optical moduleADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2157US11430906B2Optical device including lid having first and second cavity with inclined sidewallsADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 30, 2022·0 cites·17 claims
- 2256US10508910B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 17, 2019·0 cites·27 claims
- 2355US10629787B2Lid and an optical device package having the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 21, 2020·0 cites·5 claims
- 2453US11588081B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 21, 2023·0 cites·12 claims
- 2553US11296025B2Interconnection structure and sensor packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 5, 2022·0 cites·24 claims
- 2653US10177283B2LED packages and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 8, 2019·0 cites·22 claims
- 2751US9850124B2Semiconductor device package for reducing parasitic light and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 26, 2017·0 cites·13 claims
- 2849US10910532B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 2, 2021·0 cites·22 claims
- 2946US11276797B2Optical device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·0 cites·14 claims
- 3046US10453760B2Lid array panel, package with lid and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Oct 22, 2019·0 cites·22 claims
- 3145US9653656B2LED packages and related methodsCHAN HSUN-WEI·Filed 2012·Granted May 16, 2017·0 cites·20 claims
- 3243US9881845B1Electronic device, lid structure and package structureADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jan 30, 2018·0 cites·21 claims
- 3341US2018315894A1Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 3439US10862014B2Optical device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 8, 2020·0 cites·15 claims
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