Inventor · disambiguated record
Gaku Echigoya
Also filed as: ECHIGOYA GAKU
3 granted patents·2 pending applications·1 citations·filing 2021–2024
50Inventor score
Files withTDK CORP5
Top patents by PatentIndex Score
5 records- 0177US11645480B2Method of manufacturing multilayer chip componentTDK CORP·Filed 2021·Granted May 9, 2023·1 cites·20 claims
- 0269US11983583B2Multilayer chip componentTDK CORP·Filed 2023·Granted May 14, 2024·0 cites·9 claims
- 0363US2025022649A1Electronic componentTDK CORP·Filed 2024·Application pending·0 cites
- 0462US11568192B2Multilayer chip componentTDK CORP·Filed 2021·Granted Jan 31, 2023·0 cites·6 claims
- 0540US2021248435A1Method of manufacturing multilayer chip componentTDK CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →