Inventor · disambiguated record
Byung Kuk Jeon
Also filed as: JEON BYUNG KUK
1 granted patent·1 pending application·1 citations·filing 2013–2014
16Inventor score
Technology areasC08K
Top patents by PatentIndex Score
2 records- 0170US9862870B2Thermally-conductive polycarbonate resin composition and molded product formed therefromSAMSUNG SDI CO LTD·Filed 2013·Granted Jan 9, 2018·1 cites·12 claims
- 0249US2014264181A1Thermoplastic Resin Composition Having Excellent EMI Shielding PropertyCHEIL IND INC·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →