Inventor · disambiguated record
Mika Okumura
Also filed as: OKUMURA MIKA
17 granted patents·1 pending application·44 citations·filing 2001–2017
90Inventor score
Top patents by PatentIndex Score
18 records- 0190US8390121B2Semiconductor device and method of manufacture thereofOKUMURA MIKA·Filed 2011·Granted Mar 5, 2013·16 cites·6 claims
- 0266US7533570B2Electrostatic-capacitance-type acceleration sensorMITSUBISHI ELECTRIC CORP·Filed 2006·Granted May 19, 2009·5 cites·8 claims
- 0360US7900515B2Acceleration sensor and fabrication method thereofMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Mar 8, 2011·3 cites·13 claims
- 0453US6958529B2Acceleration sensor and method of manufacture thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Oct 25, 2005·6 cites·8 claims
- 0553US6900071B2Substrate and method for producing the same, and thin film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 31, 2005·4 cites·8 claims
- 0648US11459226B2Semiconductor device and semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 4, 2022·0 cites·8 claims
- 0746US8304899B2Element wafer and method for manufacturing the sameOKUMURA MIKA·Filed 2008·Granted Nov 6, 2012·0 cites·9 claims
- 0846US6812568B2Electrode structure, and method for manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 2, 2004·3 cites·20 claims
- 0943US8193631B2Semiconductor device and method of manufacturing the semiconductor deviceSATO KIMITOSHI·Filed 2008·Granted Jun 5, 2012·0 cites·13 claims
- 1043US7041593B2Method for manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 9, 2006·2 cites·9 claims
- 1143US6905905B2Method of manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 14, 2005·2 cites·10 claims
- 1241US10252905B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Apr 9, 2019·0 cites·2 claims
- 1340US7495301B2Thin film accelerometerMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Feb 24, 2009·0 cites·7 claims
- 1440US7094620B2Semiconductor device manufacturing methodMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Aug 22, 2006·1 cites·16 claims
- 1540US6784011B2Method for manufacturing thin-film structureMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 31, 2004·2 cites·6 claims
- 1637US8618666B2Semiconductor device and method of manufacturing the sameOKUMURA MIKA·Filed 2010·Granted Dec 31, 2013·0 cites·10 claims
- 1736US2012160029A1Acceleration sensorYAMAGUCHI YASUO·Filed 2011·Application pending·0 cites
- 1827US7371600B2Thin-film structure and method for manufacturing the same, and acceleration sensor and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted May 13, 2008·0 cites·9 claims
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