Assignee
OKUMURA MIKA
JP·3 granted patents·16 citations·filing 2008–2011
Top patents by PatentIndex Score
3 records- 0190US8390121B2Semiconductor device and method of manufacture thereofOKUMURA MIKA·Filed 2011·Granted Mar 5, 2013·16 cites·6 claims
- 0246US8304899B2Element wafer and method for manufacturing the sameOKUMURA MIKA·Filed 2008·Granted Nov 6, 2012·0 cites·9 claims
- 0337US8618666B2Semiconductor device and method of manufacturing the sameOKUMURA MIKA·Filed 2010·Granted Dec 31, 2013·0 cites·10 claims
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