Inventor · disambiguated record
Hiroyuki Fujishima
Also filed as: FUJISHIMA HIROYUKI
4 granted patents·5 pending applications·92 citations·filing 1996–2021
74Inventor score
Top patents by PatentIndex Score
9 records- 0188US8274143B2Semiconductor device, method of forming the same, and electronic deviceFUJISHIMA HIROYUKI·Filed 2010·Granted Sep 25, 2012·22 cites·21 claims
- 0287US6136444ATransparent conductive sheetTEIJIN LTD·Filed 1996·Granted Oct 24, 2000·69 cites·20 claims
- 0362US9553036B1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2015·Granted Jan 24, 2017·1 cites·15 claims
- 0454US12094809B2Chip-middle type fan-out panel-level package and packaging method thereofPOWERTECH TECHNOLOGY INC·Filed 2021·Granted Sep 17, 2024·0 cites·7 claims
- 0545US2017084513A1Semiconductor packagePOWERTECH TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 0641US2020343184A1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 0736US2012146242A1Semiconductor device and method of fabricating the sameFUJISHIMA HIROYUKI·Filed 2011·Application pending·0 cites
- 0836US2010301468A1Semiconductor device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 0935US2019013283A1Semiconductor package and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →