Inventor · disambiguated record
Bin Lian
Also filed as: LIAN BIN · LIAN BIN C
16 granted patents·6 pending applications·499 citations·filing 1999–2016
94Inventor score
Top patents by PatentIndex Score
22 records- 0198US6550531B1Vapor chamber active heat sinkINTEL CORP·Filed 2000·Granted Apr 22, 2003·106 cites·4 claims
- 0294US6327145B1Heat sink with integrated fluid circulation pumpINTEL CORP·Filed 2000·Granted Dec 4, 2001·100 cites·23 claims
- 0392US6521516B2Process for local on-chip cooling of semiconductor devices using buried microchannelsINTEL CORP·Filed 2001·Granted Feb 18, 2003·75 cites·22 claims
- 0489US6752204B2Iodine-containing thermal interface materialINTEL CORP·Filed 2001·Granted Jun 22, 2004·43 cites·20 claims
- 0587US6648506B2Fluorescence emission ratio imaging thermography for use in heat transfer analysisUNIV MICHIGAN STATE·Filed 2001·Granted Nov 18, 2003·45 cites·5 claims
- 0686US8968684B2Microplates, reaction modules and detection systemsLIAN BIN·Filed 2011·Granted Mar 3, 2015·10 cites·6 claims
- 0784US6486589B1Circuit card assembly having controlled vibrational propertiesINTEL CORP·Filed 2000·Granted Nov 26, 2002·33 cites·13 claims
- 0871US6774310B1Surface mount connector leadINTEL CORP·Filed 2000·Granted Aug 10, 2004·9 cites·22 claims
- 0971US6649937B2Semiconductor device with components embedded in backside diamond layerINTEL CORP·Filed 2002·Granted Nov 18, 2003·14 cites·17 claims
- 1068US6731221B1Electrically modifiable product labelingINTEL CORP·Filed 1999·Granted May 4, 2004·34 cites·5 claims
- 1162US6359372B1Circuit card assembly having controlled expansion propertiesINTEL CORP·Filed 2000·Granted Mar 19, 2002·9 cites·17 claims
- 1257US6797085B1Metallurgically enhanced heat sinkINTEL CORP·Filed 2000·Granted Sep 28, 2004·3 cites·14 claims
- 1352US6913999B2Semiconductor device with components embedded in backside diamond layerINTEL CORP·Filed 2003·Granted Jul 5, 2005·4 cites·17 claims
- 1452US6775122B1Circuit board with added impedanceINTEL CORP·Filed 1999·Granted Aug 10, 2004·14 cites·20 claims
- 1541US7057114B2Circuit board with added impedanceINTEL CORP·Filed 2003·Granted Jun 6, 2006·0 cites·5 claims
- 1641US2003006942A1Ergonomic auxiliary screen and display subsystem for portable handheld devicesFiled 2001·Application pending·0 cites
- 1741US2003080938A1Self-powered wireless deviceFiled 2001·Application pending·0 cites
- 1840US2004017295A1Electrically modifiable product labelingFiled 2003·Application pending·0 cites
- 1939US2002118511A1Heat dissipation deviceFiled 2001·Application pending·0 cites
- 2035US2002067596A1Conduited heat dissipation deviceFiled 2000·Application pending·0 cites
- 2133US2018220103A1Camera and surveillance system for video surveillanceHANGZHOU HIKVISION DIGITAL TEC·Filed 2016·Application pending·0 cites
- 2232US6624643B2Apparatus and method to read output information from a backside of a silicon deviceINTEL CORP·Filed 2000·Granted Sep 23, 2003·0 cites·29 claims
Join the waitlist — get patent alerts
Get an alert when Bin Lian files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →