Inventor · disambiguated record

Kyohei Koutake

Also filed as: KOUTAKE KYOHEI

1 granted patent·1 pending application·2 citations·filing 2011–2013

19Inventor score

Technology areasB24B H10P

Files withDENSO CORP1 KOUTAKE KYOHEI1

Top patents by PatentIndex Score

2 records

0159US8758087B2Wafer processing method, wafer polishing apparatus, and ingot slicing apparatusKOUTAKE KYOHEI·Filed 2011·Granted Jun 24, 2014·2 cites·6 claims
0240US2013217305A1High hardness material working method and working apparatusDENSO CORP·Filed 2013·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →