Inventor · disambiguated record
Yi Pan
Also filed as: PAN YI · PAN YI-HSIANG
8 granted patents·4 pending applications·58 citations·filing 1999–2018
84Inventor score
Top patents by PatentIndex Score
12 records- 0190US9437515B2Heat spreading layer with high thermal conductivityIBM·Filed 2015·Granted Sep 6, 2016·6 cites·1 claims
- 0280US10424494B2Chip module with stiffening frame and orthogonal heat spreaderIBM·Filed 2017·Granted Sep 24, 2019·2 cites·7 claims
- 0377US9583408B1Reducing directional stress in an orthotropic encapsulation member of an electronic packageIBM·Filed 2015·Granted Feb 28, 2017·3 cites·15 claims
- 0468US6204553B1Lead frame structureWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Mar 20, 2001·40 cites·11 claims
- 0560US10566215B2Method of fabricating a chip module with stiffening frame and orthogonal heat spreaderIBM·Filed 2017·Granted Feb 18, 2020·0 cites·5 claims
- 0659US10892170B2Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreaderIBM·Filed 2018·Granted Jan 12, 2021·0 cites·12 claims
- 0754US6486564B2Heat dissipation module for a BGA ICWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Nov 26, 2002·7 cites·19 claims
- 0854US2014284040A1Heat spreading layer with high thermal conductivityIBM·Filed 2013·Application pending·0 cites
- 0953US10090173B2Method of fabricating a chip module with stiffening frame and directional heat spreaderIBM·Filed 2015·Granted Oct 2, 2018·0 cites·6 claims
- 1052US2015371917A1Heat spreading layer with high thermal conductivityIBM·Filed 2015·Application pending·0 cites
- 1152US2015373879A1Heat spreading layer with high thermal conductivityIBM·Filed 2015·Application pending·0 cites
- 1252US2015371918A1Heat spreading layer with high thermal conductivityIBM·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yi Pan files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →