Inventor · disambiguated record
Kyaw Oo Aung
Also filed as: AUNG KYAW O · AUNG KYAW OO
3 granted patents·3 pending applications·6 citations·filing 2004–2021
60Inventor score
Files withST ASSEMBLY TEST SERVICES LTD2AMS OSRAM ASIA PACIFIC PTE LTD1AMS SENSORS ASIA PTE LTD1STATS CHIPPAC LTD1ZHAO XING1
Top patents by PatentIndex Score
6 records- 0165US7443039B2System for different bond pads in an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2005·Granted Oct 28, 2008·3 cites·10 claims
- 0256US9281274B1Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereofZHAO XING·Filed 2013·Granted Mar 8, 2016·1 cites·17 claims
- 0344US7005370B2Method of manufacturing different bond pads on the same substrate of an integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 28, 2006·2 cites·10 claims
- 0444US2023286233A1Optical module productionAMS OSRAM ASIA PACIFIC PTE LTD·Filed 2021·Application pending·0 cites
- 0541US2023005896A1Wafer level chip scale packagingAMS SENSORS ASIA PTE LTD·Filed 2021·Application pending·0 cites
- 0634US2006160267A1Under bump metallurgy in integrated circuitsSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →