Inventor · disambiguated record
Harald Okorn-Schmidt
Also filed as: OKORN-SCHMIDT HARALD · OKORN-SCHMIDT HARALD F · OKORN-SCHMIDT HARALD FRANZ
30 granted patents·5 pending applications·691 citations·filing 1997–2022
97Inventor score
Top patents by PatentIndex Score
35 records- 0197US6444592B1Interfacial oxidation process for high-k gate dielectric process integrationIBM·Filed 2000·Granted Sep 3, 2002·191 cites·22 claims
- 0289US6511873B2High-dielectric constant insulators for FEOL capacitorsIBM·Filed 2001·Granted Jan 28, 2003·38 cites·19 claims
- 0389US6413386B1Reactive sputtering method for forming metal-silicon layerIBM·Filed 2000·Granted Jul 2, 2002·40 cites·22 claims
- 0487US6276370B1Sonic cleaning with an interference signalIBM·Filed 1999·Granted Aug 21, 2001·90 cites·48 claims
- 0578US6200891B1Removal of dielectric oxidesIBM·Filed 1998·Granted Mar 13, 2001·54 cites·29 claims
- 0676US6033996AProcess for removing etching residues, etching mask and silicon nitride and/or silicon dioxideIBM·Filed 1997·Granted Mar 7, 2000·48 cites·23 claims
- 0776US5962384AMethod for cleaning semiconductor devicesIBM·Filed 1997·Granted Oct 5, 1999·40 cites·9 claims
- 0871US6667207B2High-dielectric constant insulators for FEOL capacitorsIBM·Filed 2002·Granted Dec 23, 2003·12 cites·17 claims
- 0971US6354309B1Process for treating a semiconductor substrateIBM·Filed 2000·Granted Mar 12, 2002·13 cites·14 claims
- 1068US11164748B2Method and device for plating a recess in a substrateSEMSYSCO GMBH·Filed 2019·Granted Nov 2, 2021·1 cites·12 claims
- 1167US5965465AEtching of silicon nitrideIBM·Filed 1997·Granted Oct 12, 1999·28 cites·17 claims
- 1266US8709165B2Method and apparatus for surface treatment using inorganic acid and ozoneOKORN-SCHMIDT HARALD·Filed 2010·Granted Apr 29, 2014·2 cites·7 claims
- 1366US7497959B2Methods and structures for protecting one area while processing another area on a chipIBM·Filed 2004·Granted Mar 3, 2009·7 cites·10 claims
- 1464US11908698B2Method and device for plating a recess in a substrateSEMSYSCO GMBH·Filed 2021·Granted Feb 20, 2024·0 cites·18 claims
- 1564US6066267AEtching of silicon nitrideIBM·Filed 1999·Granted May 23, 2000·24 cites·10 claims
- 1661US6254796B1Selective etching of silicateIBM·Filed 1998·Granted Jul 3, 2001·24 cites·20 claims
- 1761US6150282ASelective removal of etching residuesIBM·Filed 1997·Granted Nov 21, 2000·25 cites·40 claims
- 1861US2025034709A1Distribution body for distributing a process gas for treating a substrate by means of the process gasSEMSYSCO GMBH·Filed 2022·Application pending·0 cites
- 1959US12351921B2Distribution body for a process fluid for chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2020·Granted Jul 8, 2025·0 cites·21 claims
- 2059US6117796ARemoval of silicon oxideIBM·Filed 1998·Granted Sep 12, 2000·23 cites·17 claims
- 2158US9472402B2Methods and structures for protecting one area while processing another area on a chipGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 18, 2016·0 cites·7 claims
- 2257US9059000B2Methods and structures for protecting one area while processing another area on a chipKIM DEOK-KEE·Filed 2008·Granted Jun 16, 2015·0 cites·17 claims
- 2356US6191085B1Method for cleaning semiconductor devicesIBM·Filed 1999·Granted Feb 20, 2001·17 cites·10 claims
- 2452US2023313407A1Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2021·Application pending·0 cites
- 2551US9653328B2Method and apparatus for surface treatment using inorganic acid and ozoneOKORN-SCHMIDT HARALD·Filed 2014·Granted May 16, 2017·0 cites·14 claims
- 2651US6958506B2High-dielectric constant insulators for feol capacitorsIBM·Filed 2003·Granted Oct 25, 2005·3 cites·8 claims
- 2747US7887711B2Method for etching chemically inert metal oxidesIBM·Filed 2002·Granted Feb 15, 2011·1 cites·19 claims
- 2842US2007295367A1Apparatus and Method For Wet Treatment of WafersSEZ AG·Filed 2005·Application pending·0 cites
- 2940US8668777B2Process for treating a semiconductor waferOKORN-SCHMIDT HARALD·Filed 2010·Granted Mar 11, 2014·0 cites·20 claims
- 3040US6173720B1Process for treating a semiconductor substrateIBM·Filed 1998·Granted Jan 16, 2001·7 cites·19 claims
- 3138US6634371B2Apparatus for removing contaminants from a workpiece using a chemically reactive additiveIBM·Filed 2001·Granted Oct 21, 2003·0 cites·8 claims
- 3237US2003196679A1Process and apparatus for contacting a precision surface with liquid or supercritical carbon dioxideIBM·Filed 2002·Application pending·0 cites
- 3336US2002197836A1Method of forming variable oxide thicknesses across semiconductor chipsIBM·Filed 2001·Application pending·0 cites
- 3435US10249521B2Wet-dry integrated wafer processing systemLAM RES AG·Filed 2016·Granted Apr 2, 2019·0 cites·20 claims
- 3531US6355111B1Method for removing contaminants from a workpiece using a chemically reactive additiveIBM·Filed 1999·Granted Mar 12, 2002·3 cites·26 claims
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