Inventor · disambiguated record
Shunichi Kikuchi
Also filed as: KIKUCHI SHUNICHI
23 granted patents·4 pending applications·926 citations·filing 1986–2018
97Inventor score
Top patents by PatentIndex Score
27 records- 0195US4712158ACooling system for electronic circuit componentsFUJITSU LTD·Filed 1986·Granted Dec 8, 1987·112 cites·11 claims
- 0292US6399897B1Multi-layer wiring substrateFUJITSU LTD·Filed 2000·Granted Jun 4, 2002·63 cites·6 claims
- 0390US10443957B2Cooling plate and information processing deviceFUJITSU LTD·Filed 2018·Granted Oct 15, 2019·7 cites·10 claims
- 0489US4920574ACooling system for an electronic circuit deviceFUJITSU LTD·Filed 1987·Granted Apr 24, 1990·87 cites·11 claims
- 0588US5763950ASemiconductor element cooling apparatusFUJITSU LTD·Filed 1996·Granted Jun 9, 1998·111 cites·8 claims
- 0688US5126919ACooling system for an electronic circuit deviceFUJITSU LTD·Filed 1988·Granted Jun 30, 1992·83 cites·38 claims
- 0788US4783721ACooling system for an electronic circuit deviceFUJITSU LTD·Filed 1987·Granted Nov 8, 1988·73 cites·9 claims
- 0887US7199718B2RFID tag with thermal conductive coverFUJITSU LTD·Filed 2005·Granted Apr 3, 2007·14 cites·6 claims
- 0986US9642287B2Cooling plate and data processing system provided with cooling platesFUJITSU LTD·Filed 2016·Granted May 2, 2017·3 cites·13 claims
- 1086US4879632ACooling system for an electronic circuit deviceFUJITSU LTD·Filed 1986·Granted Nov 7, 1989·67 cites·36 claims
- 1184US5050037ALiquid-cooling module system for electronic circuit componentsFUJITSU LTD·Filed 1988·Granted Sep 17, 1991·76 cites·24 claims
- 1278US5894882AHeat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structureFUJITSU LTD·Filed 1996·Granted Apr 20, 1999·60 cites·17 claims
- 1378US5586006AMulti-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked togetherFUJITSU LTD·Filed 1995·Granted Dec 17, 1996·59 cites·32 claims
- 1477US6300678B1I/O pin having solder dam for connecting substratesFUJITSU LTD·Filed 1998·Granted Oct 9, 2001·56 cites·12 claims
- 1567US7214563B2IC chip mounting methodFUJITSU FRONTECH LTD·Filed 2005·Granted May 8, 2007·3 cites·12 claims
- 1663US6054652AThin-film multi-layer substrate and electronic deviceFUJITSU LTD·Filed 1997·Granted Apr 25, 2000·31 cites·6 claims
- 1762US7951249B2RFID tagFUJITSU LTD·Filed 2007·Granted May 31, 2011·2 cites·5 claims
- 1860US7431218B2RFID tag, module component, and RFID tag fabrication methodFUJITSU LTD·Filed 2005·Granted Oct 7, 2008·1 cites·5 claims
- 1947US2006161787A1Authentication key and apparatus, method, and computer program for authenticationFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2045US10108235B2Information processing apparatus and heat exchangerFUJITSU LTD·Filed 2017·Granted Oct 23, 2018·0 cites·14 claims
- 2145US6891247B2Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bondingFUJITSU LTD·Filed 2002·Granted May 10, 2005·6 cites·7 claims
- 2243US6465085B1Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the sameFUJITSU LTD·Filed 2000·Granted Oct 15, 2002·2 cites·20 claims
- 2343US6303877B2Multilayer thin-film wiring boardFUJITSU LTD·Filed 1998·Granted Oct 16, 2001·10 cites·4 claims
- 2442US2011132654A1Multilayer printed circuit board, method for manufacturing the same, and electronic apparatusFUJITSU LTD·Filed 2010·Application pending·0 cites
- 2538US6787711B2Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board deviceFUJITSU LTD·Filed 2002·Granted Sep 7, 2004·0 cites·10 claims
- 2636US2011286188A1Multilayer printed circuit board using flexible interconnect structure, and method of making sameKANAI RYO·Filed 2011·Application pending·0 cites
- 2735US2017084581A1Laminated chip, laminated-chip-mounted substrate and manufacturing method of laminated chipFUJITSU LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →