Inventor · disambiguated record
Michael Bauer
Also filed as: BAUER MICHAEL · BAUER MICHAEL PAUL · BAUER MICHAEL PAUL SCOTT
94 granted patents·12 pending applications·791 citations·filing 2002–2024
99Inventor score
Files withINFINEON TECHNOLOGIES AG79BAUER MICHAEL12MAHLER JOACHIM5MICROSOFT TECHNOLOGY LICENSING LLC2AIRBUS DEFENCE & SPACE GMBH1
Top patents by PatentIndex Score
106 records- 0197US7545047B2Semiconductor device with a wiring substrate and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jun 9, 2009·78 cites·17 claims
- 0296US7683460B2Module with a shielding and/or heat dissipating elementINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 23, 2010·54 cites·29 claims
- 0394US7749797B2Semiconductor device having a sensor chip, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 6, 2010·36 cites·23 claims
- 0494US7619304B2Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 17, 2009·43 cites·8 claims
- 0594US7482198B2Method for producing through-contacts and a semiconductor component with through-contactsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 27, 2009·38 cites·9 claims
- 0692US7464603B2Sensor component with a cavity housing and a sensor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 16, 2008·26 cites·15 claims
- 0791US8350382B2Semiconductor device including electronic component coupled to a backside of a chipINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 8, 2013·22 cites·9 claims
- 0890US8669655B2Chip package and a method for manufacturing a chip packageGEITNER OTTMAR·Filed 2012·Granted Mar 11, 2014·26 cites·24 claims
- 0989US7420262B2Electronic component and semiconductor wafer, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 2, 2008·52 cites·9 claims
- 1088US7795727B2Semiconductor module having discrete components and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 14, 2010·17 cites·14 claims
- 1188US7276785B2Electronic module, panel having electronic modules which are to be divided up, and process for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 2, 2007·68 cites·10 claims
- 1287US8574966B2Semiconductor device having a semiconductor chip, and method for the production thereofBAUER MICHAEL·Filed 2012·Granted Nov 5, 2013·6 cites·9 claims
- 1386US7705436B2Semiconductor device with semiconductor chip and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 27, 2010·13 cites·37 claims
- 1485US7629660B2Semiconductor sensor component including a sensor chip and methods for the manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 8, 2009·14 cites·16 claims
- 1585US7462940B2Semiconductor component comprising flip chip contacts with polymer cores and method of producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 9, 2008·13 cites·15 claims
- 1685US7443019B2Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Oct 28, 2008·13 cites·13 claims
- 1782US8011495B2Transfer device metering apparatus and methodsDOUGLAS MACHINE INC·Filed 2008·Granted Sep 6, 2011·16 cites·20 claims
- 1882US7944061B2Semiconductor device having through contacts through a plastic housing composition and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 17, 2011·10 cites·10 claims
- 1981US9881909B2Method for attaching a semiconductor die to a carrierINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 30, 2018·4 cites·10 claims
- 2081US7656018B2Package for an electronic component and method for its productionINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 2, 2010·10 cites·8 claims
- 2180US10978418B2Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layerINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 13, 2021·2 cites·20 claims
- 2280US7843055B2Semiconductor device having an adhesion promoting layer and method for producing itINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 30, 2010·9 cites·20 claims
- 2379US7935622B2Support with solder ball elements and a method for populating substrates with solder ballsINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 3, 2011·6 cites·6 claims
- 2479US7638418B2Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Dec 29, 2009·8 cites·8 claims
- 2579US7554196B2Plastic package and semiconductor component comprising such a plastic package, and method for its productionINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jun 30, 2009·10 cites·14 claims
- 2679US7009288B2Semiconductor component with electromagnetic shielding deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 7, 2006·31 cites·16 claims
- 2778US10461056B2Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 29, 2019·2 cites·7 claims
- 2878US7768107B2Semiconductor component including semiconductor chip and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 3, 2010·8 cites·13 claims
- 2978US7714416B2Electronic circuit in a package-in-package configuration and production methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 11, 2010·8 cites·19 claims
- 3076US8507080B2Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting materialMAHLER JOACHIM·Filed 2006·Granted Aug 13, 2013·7 cites·14 claims
- 3176US8017438B2Semiconductor module with at least two substratesINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 13, 2011·7 cites·7 claims
- 3276US8013441B2Power semiconductor device in lead frame employing connecting element with conductive filmINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 6, 2011·7 cites·20 claims
- 3376US7666777B2Electronic structure with components connected by way of solderable connecting elements and methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 23, 2010·7 cites·9 claims
- 3475US7230309B2Semiconductor component and sensor component for data transmission devicesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 12, 2007·23 cites·10 claims
- 3574US7834467B2Layer between interfaces of different components in semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·6 cites·17 claims
- 3674US7675146B2Semiconductor device with leadframe including a diffusion barrierINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 9, 2010·6 cites·21 claims
- 3773US8173488B2Electronic device and method of manufacturing sameBAUER MICHAEL·Filed 2008·Granted May 8, 2012·6 cites·16 claims
- 3873US7408241B2Semiconductor device with a recessed bond padINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 5, 2008·5 cites·19 claims
- 3972US9633927B2Chip arrangement and method for producing a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 25, 2017·2 cites·19 claims
- 4072US7589403B2Lead structure for a semiconductor component and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 15, 2009·5 cites·10 claims
- 4171US7993969B2Method for producing a module with components stacked one above anotherINFINEON TECHNOLOGIES AG·Filed 2006·Granted Aug 9, 2011·4 cites·14 claims
- 4271US6906392B2Micromechanical componentPARAGON AG·Filed 2002·Granted Jun 14, 2005·17 cites·16 claims
- 4370US8178390B2Semiconductor component and production methodMAHLER JOACHIM·Filed 2006·Granted May 15, 2012·3 cites·11 claims
- 4470US7612457B2Semiconductor device including a stress bufferINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 3, 2009·5 cites·27 claims
- 4569US8659135B2Semiconductor device stack and method for its productionBAUER MICHAEL·Filed 2005·Granted Feb 25, 2014·5 cites·8 claims
- 4668US12033972B2Chip package, method of forming a chip package and method of forming an electrical contactINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 9, 2024·0 cites·12 claims
- 4767US8906749B2Method for fabricating a semiconductor deviceBAUER MICHAEL·Filed 2012·Granted Dec 9, 2014·2 cites·18 claims
- 4867US7795742B2Semiconductor device having a semiconductor chip, and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 14, 2010·2 cites·21 claims
- 4966US7880300B2Semiconductor chip comprising a metal coating structure and associated production methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 1, 2011·3 cites·23 claims
- 5064US10497587B1Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materialsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 3, 2019·1 cites·19 claims
Showing the top 50 of 106 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →