Inventor · disambiguated record
Tien-Jen Cheng
Also filed as: CHENG TIEN · CHENG TIEN-JEN · CHENG TIEN-JEN J
34 granted patents·9 pending applications·365 citations·filing 1997–2015
97Inventor score
Top patents by PatentIndex Score
43 records- 0199US8916448B2Metal to metal bonding for stacked (3D) integrated circuitsIBM·Filed 2013·Granted Dec 23, 2014·82 cites·20 claims
- 0296US6534863B2Common ball-limiting metallurgy for I/O sitesIBM·Filed 2001·Granted Mar 18, 2003·112 cites·17 claims
- 0394US8129269B1Method of improving mechanical properties of semiconductor interconnects with nanoparticlesBAO JUNJING·Filed 2010·Granted Mar 6, 2012·15 cites·14 claims
- 0490US8232200B1Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed therebyOH HYEOK-SANG·Filed 2011·Granted Jul 31, 2012·21 cites·20 claims
- 0585US9017487B2Deposition chamber cleaning method including stressed cleaning layerIBM·Filed 2013·Granted Apr 28, 2015·2 cites·15 claims
- 0682US8415252B2Selective copper encapsulation layer depositionCHENG TIEN-JEN·Filed 2010·Granted Apr 9, 2013·7 cites·20 claims
- 0782US8105937B2Conformal adhesion promoter liner for metal interconnectsCHENG TIEN-JEN·Filed 2008·Granted Jan 31, 2012·8 cites·9 claims
- 0882US7144490B2Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layerIBM·Filed 2003·Granted Dec 5, 2006·14 cites·7 claims
- 0981US7566649B2Compressible films surrounding solder connectorsIBM·Filed 2007·Granted Jul 28, 2009·8 cites·19 claims
- 1077US6927472B2Fuse structure and method to form the sameIBM·Filed 2001·Granted Aug 9, 2005·20 cites·15 claims
- 1174US8444868B2Method for removing copper oxide layerCHENG TIEN-JEN·Filed 2010·Granted May 21, 2013·3 cites·19 claims
- 1273US9017486B2Deposition chamber cleaning method including stressed cleaning layerCHENG TIEN-JEN·Filed 2010·Granted Apr 28, 2015·1 cites·15 claims
- 1372US9673176B2Metal to metal bonding for stacked (3D) integrated circuitsIBM·Filed 2015·Granted Jun 6, 2017·1 cites·19 claims
- 1472US9666563B2Metal to metal bonding for stacked (3D) integrated circuitsIBM·Filed 2015·Granted May 30, 2017·1 cites·19 claims
- 1572US7473997B2Method for forming robust solder interconnect structures by reducing effects of seed layer underetchingIBM·Filed 2005·Granted Jan 6, 2009·4 cites·10 claims
- 1669US7923836B2BLM structure for application to copper padIBM·Filed 2006·Granted Apr 12, 2011·4 cites·15 claims
- 1764US8026166B2Interconnect structures comprising capping layers with low dielectric constants and methods of making the sameIBM·Filed 2008·Granted Sep 27, 2011·3 cites·7 claims
- 1863US6896784B2Method for controlling local current to achieve uniform plating thicknessIBM·Filed 2004·Granted May 24, 2005·8 cites·6 claims
- 1962US6995475B2I/C chip suitable for wire bondingIBM·Filed 2003·Granted Feb 7, 2006·9 cites·3 claims
- 2061US8373273B2Methods of forming integrated circuit devices having damascene interconnects therein with metal diffusion barrier layers and devices formed therebySAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Feb 12, 2013·1 cites·5 claims
- 2161US6995084B2Method for forming robust solder interconnect structures by reducing effects of seed layer underetchingIBM·Filed 2004·Granted Feb 7, 2006·7 cites·12 claims
- 2260US9515051B2Metal to metal bonding for stacked (3D) integrated circuitsIBM·Filed 2014·Granted Dec 6, 2016·0 cites·19 claims
- 2358US7332821B2Compressible films surrounding solder connectorsIBM·Filed 2004·Granted Feb 19, 2008·7 cites·21 claims
- 2457US6924185B2Fuse structure and method to form the sameIBM·Filed 2003·Granted Aug 2, 2005·6 cites·9 claims
- 2557US6890413B2Method and apparatus for controlling local current to achieve uniform plating thicknessIBM·Filed 2002·Granted May 10, 2005·6 cites·13 claims
- 2656US9653431B2Metal to metal bonding for stacked (3D) integrated circuitsIBM·Filed 2015·Granted May 16, 2017·0 cites·20 claims
- 2756US9653432B2Metal to metal bonding for stacked (3D) integrated circuitsIBM·Filed 2015·Granted May 16, 2017·0 cites·20 claims
- 2853US8384219B2Semiconductor having interconnects with improved mechanical properties by insertion of nanoparticlesIBM·Filed 2012·Granted Feb 26, 2013·0 cites·22 claims
- 2953US6235412B1Corrosion-resistant terminal metal pads for thin film packagesIBM·Filed 2000·Granted May 22, 2001·4 cites·16 claims
- 3050US6992389B2Barrier for interconnect and methodIBM·Filed 2004·Granted Jan 31, 2006·4 cites·10 claims
- 3146US7572726B2Method of forming a bond pad on an I/C chip and resulting structureIBM·Filed 2005·Granted Aug 11, 2009·0 cites·15 claims
- 3246US2006249854A1Device with area array pads for test probingCHENG TIEN-JEN·Filed 2006·Application pending·0 cites
- 3345US7767575B2Forming robust solder interconnect structures by reducing effects of seed layer underetchingTESSERA INTELLECTUAL PROPERTIE·Filed 2009·Granted Aug 3, 2010·0 cites·5 claims
- 3445US2008119056A1Method for improved copper layer etching of wafers with c4 connection structuresIBM·Filed 2006·Application pending·0 cites
- 3543US2014097539A1Technique for uniform cmpST MICROELECTRONICS INC·Filed 2013·Application pending·0 cites
- 3643US2015076695A1Selective passivation of viasIBM·Filed 2013·Application pending·0 cites
- 3740US2003092254A1Common ball-limiting metallurgy for I/O sitesFiled 2002·Application pending·0 cites
- 3840US2005167837A1Device with area array pads for test probingIBM·Filed 2004·Application pending·0 cites
- 3939US2005026416A1Encapsulated pin structure for improved reliability of waferIBM·Filed 2003·Application pending·0 cites
- 4038US2013095649A1Chemical Bath ReplenishmentCHENG TIEN-JEN·Filed 2011·Application pending·0 cites
- 4137US6083375AProcess for producing corrosion-resistant terminal metal pads for thin film packagesIBM·Filed 1998·Granted Jul 4, 2000·5 cites·23 claims
- 4237US2005104208A1Stabilizing copper overlayer for enhanced c4 interconnect reliabilityIBM·Filed 2003·Application pending·0 cites
- 4323US5728433AMethod for gold replenishment of electroless gold bathENGELHARD CORP·Filed 1997·Granted Mar 17, 1998·2 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →