Inventor · disambiguated record
Hidehiko Akasaki
Also filed as: AKASAKI HIDEHIKO
10 granted patents·375 citations·filing 1982–1998
92Inventor score
Files withFUJITSU LTD10
Top patents by PatentIndex Score
10 records- 0184US4682207ASemiconductor device including leadless packages and a base plate for mounting the leadless packagesFUJITSU LTD·Filed 1986·Granted Jul 21, 1987·72 cites·7 claims
- 0282US6063640ASemiconductor wafer testing method with probe pin contactFUJITSU LTD·Filed 1998·Granted May 16, 2000·68 cites·31 claims
- 0380US4539622AHybrid integrated circuit deviceFUJITSU LTD·Filed 1984·Granted Sep 3, 1985·49 cites·4 claims
- 0478US5861670ASemiconductor device packageFUJITSU LTD·Filed 1996·Granted Jan 19, 1999·60 cites·3 claims
- 0577US6166433AResin molded semiconductor device and method of manufacturing semiconductor packageFUJITSU LTD·Filed 1998·Granted Dec 26, 2000·59 cites·16 claims
- 0670US4458291APackage for enclosing semiconductor elementsFUJITSU LTD·Filed 1982·Granted Jul 3, 1984·36 cites·7 claims
- 0749USD276719SIntegrated circuit deviceFUJITSU LTD·Filed 1982·Granted Dec 11, 1984·4 cites·1 claims
- 0840US4689658AModular semiconductor deviceFUJITSU LTD·Filed 1983·Granted Aug 25, 1987·9 cites·5 claims
- 0939US4710250AMethod for producing a package for a semiconductor deviceFUJITSU LTD·Filed 1986·Granted Dec 1, 1987·10 cites·6 claims
- 1031US4737884ASemiconductor device moduleFUJITSU LTD·Filed 1987·Granted Apr 12, 1988·8 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →