Inventor · disambiguated record
Daisuke Himeta
Also filed as: HIMETA Daisuke
4 granted patents·1 pending application·2 citations·filing 2017–2024
56Inventor score
Technology areasH01G
Files withTDK CORP5
Top patents by PatentIndex Score
5 records- 0175US10475587B2Feedthrough capacitorTDK CORP·Filed 2018·Granted Nov 12, 2019·2 cites·4 claims
- 0251US2025037934A1Multilayer capacitorTDK CORP·Filed 2024·Application pending·0 cites
- 0344US12033802B2Multilayer capacitor having sintered electrode layer with wraparound portionTDK CORP·Filed 2022·Granted Jul 9, 2024·0 cites·8 claims
- 0444US10297390B2Electronic componentTDK CORP·Filed 2017·Granted May 21, 2019·0 cites·4 claims
- 0541US10790091B2Electronic component having depression on surfaceTDK CORP·Filed 2017·Granted Sep 29, 2020·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →