Inventor · disambiguated record
Elissa E. Carapella
Also filed as: CARAPELLA ELISSA E
2 granted patents·1 pending application·57 citations·filing 1998–2003
60Inventor score
Technology areasH10W
Files withINTEL CORP2
Top patents by PatentIndex Score
3 records- 0174US6153829ASplit cavity wall plating for an integrated circuit packageINTEL CORP·Filed 1998·Granted Nov 28, 2000·56 cites·35 claims
- 0240US7020958B1Methods forming an integrated circuit package with a split cavity wallINTEL CORP·Filed 2000·Granted Apr 4, 2006·1 cites·23 claims
- 0333US2004046243A1Methods of split cavity wall plating for an integrated circuit packageFiled 2003·Application pending·0 cites
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