Inventor · disambiguated record
Surhud Khare
Also filed as: KHARE SURHUD · KHARE SURHUD V
7 granted patents·6 pending applications·28 citations·filing 2014–2023
80Inventor score
Top patents by PatentIndex Score
13 records- 0193US9837391B2Scalable polylithic on-package integratable apparatus and methodINTEL CORP·Filed 2015·Granted Dec 5, 2017·8 cites·17 claims
- 0290US9992135B2Apparatus and method for fusion of compute and switching functions of exascale system into a single component by using configurable network-on-chip fabric with distributed dual mode input-output ports and programmable network interfacesINTEL CORP·Filed 2015·Granted Jun 5, 2018·9 cites·23 claims
- 0388US9287208B1Architecture for on-die interconnectINTEL CORP·Filed 2014·Granted Mar 15, 2016·8 cites·20 claims
- 0480US9998401B2Architecture for on-die interconnectINTEL CORP·Filed 2016·Granted Jun 12, 2018·3 cites·20 claims
- 0572US2023110247A1A scalable polylithic on-package integratable apparatus and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 0664USRE49439EScalable polylithic on-package integratable apparatus and methodINTEL CORP·Filed 2019·Granted Feb 28, 2023·0 cites·28 claims
- 0758US2025112205A1Die-to-die input/output signal routing utilizing opposing die surfaces in integrated circuit component packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 0855US12336022B2Systems and methods for optimizing wireless network accesses with peer-to-peer networksSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 0955US2024222347A1Modular memory blocks for integrated circuit devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 1054US2023125041A1Memory chip stack for high performance logic chipsINTEL CORP·Filed 2022·Application pending·0 cites
- 1151US2023207428A1Integrated circuit die for efficient incorporation in a die stackINTEL CORP·Filed 2021·Application pending·0 cites
- 1243US11134030B2Device, system and method for coupling a network-on-chip with PHY circuitryINTEL CORP·Filed 2019·Granted Sep 28, 2021·0 cites·17 claims
- 1337US2019303159A1Instruction set architecture to facilitate energy-efficient computing for exascale architecturesINTEL CORP·Filed 2018·Application pending·0 cites
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