Inventor · disambiguated record
Yenting Wen
Also filed as: WEN YENTING
15 granted patents·2 pending applications·112 citations·filing 2002–2020
91Inventor score
Top patents by PatentIndex Score
17 records- 0196US10573803B1Current sensor packages with through hole in semiconductorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Feb 25, 2020·8 cites·24 claims
- 0294US9679878B1Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jun 13, 2017·9 cites·23 claims
- 0387US7227240B2Semiconductor device with wire bond inductor and methodSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jun 5, 2007·57 cites·18 claims
- 0485US9941257B2Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Apr 10, 2018·3 cites·20 claims
- 0585US7589392B2Filter having integrated floating capacitor and transient voltage suppression structure and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Sep 15, 2009·16 cites·6 claims
- 0681US8999807B2Method for manufacturing a semiconductor component that includes a common mode choke and structureJIANG LI·Filed 2010·Granted Apr 7, 2015·7 cites·29 claims
- 0771US11417598B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 16, 2022·0 cites·20 claims
- 0871US7579670B2Integrated filter having ground plane structureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Aug 25, 2009·5 cites·19 claims
- 0968US8582317B2Method for manufacturing a semiconductor component and structure thereforWEN YENTING·Filed 2010·Granted Nov 12, 2013·4 cites·16 claims
- 1064US10811598B2Current sensor packagesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 20, 2020·0 cites·20 claims
- 1163US10651124B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted May 12, 2020·0 cites·9 claims
- 1262US10396028B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Aug 27, 2019·0 cites·17 claims
- 1361US9373600B2Package substrate structure for enhanced signal transmission and methodSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Jun 21, 2016·1 cites·20 claims
- 1459US7466212B2Semiconductor filter structure and method of manufactureSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Dec 16, 2008·2 cites·27 claims
- 1557US9984968B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted May 29, 2018·0 cites·12 claims
- 1655US2018211939A1Embedded stacked die packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Application pending·0 cites
- 1733US2009057822A1Semiconductor component and method of manufactureWEN YENTING·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →