Inventor · disambiguated record
Hermann Wendt
Also filed as: WENDT HERMANN · WENDT HERMANN WILLHELM
57 granted patents·5 pending applications·692 citations·filing 1991–2017
99Inventor score
Top patents by PatentIndex Score
62 records- 0196US9780161B2Transformer comprising a rounded coilINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 3, 2017·15 cites·19 claims
- 0295US6458603B1Method of fabricating a micro-technical structure, and micro-technical componentINFINEON TECHNOLOGIES AG·Filed 2001·Granted Oct 1, 2002·104 cites·9 claims
- 0393US8610238B2Crack stop trenchesKALTALIOGLU ERDEM·Filed 2010·Granted Dec 17, 2013·13 cites·25 claims
- 0493US7871902B2Crack stop trenchesINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 18, 2011·19 cites·24 claims
- 0591US9183977B2Method for fabricating a coil by way of a rounded trenchMENATH MARKUS·Filed 2012·Granted Nov 10, 2015·12 cites·16 claims
- 0691US8062971B2Dual damascene processRIESS PHILIPP·Filed 2008·Granted Nov 22, 2011·18 cites·26 claims
- 0789US6215140B1Electrically programmable non-volatile memory cell configurationSIEMENS AG·Filed 1999·Granted Apr 10, 2001·64 cites·29 claims
- 0886US8637967B2Method for fabricating a semiconductor chip and semiconductor chipMENATH MARKUS·Filed 2010·Granted Jan 28, 2014·9 cites·27 claims
- 0985US7723818B2Semiconductor devices and methods of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2007·Granted May 25, 2010·12 cites·19 claims
- 1081US9401322B2Semiconductor devices and structures thereofNAUJOK MARKUS·Filed 2011·Granted Jul 26, 2016·5 cites·24 claims
- 1180US7619310B2Semiconductor interconnect and method of making sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 17, 2009·10 cites·19 claims
- 1278US7629225B2Methods of manufacturing semiconductor devices and structures thereofINFINEON TECHNOLOGIES AG·Filed 2005·Granted Dec 8, 2009·6 cites·28 claims
- 1376US7452804B2Single damascene with disposable stencil and method thereforeINFINEON TECHNOLOGIES AG·Filed 2005·Granted Nov 18, 2008·8 cites·28 claims
- 1475US6573542B2Capacitor electrodes arrangement with oxygen iridium between silicon and oxygen barrier layerINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 3, 2003·18 cites·16 claims
- 1574US6040995AMethod of operating a storage cell arrangementSIEMENS AG·Filed 1997·Granted Mar 21, 2000·35 cites·4 claims
- 1673US6558770B1Perforated work piece, and method for producing itINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 6, 2003·18 cites·9 claims
- 1772US6127220AManufacturing method for a capacitor in an integrated storage circuitSIEMENS AG·Filed 1999·Granted Oct 3, 2000·29 cites·10 claims
- 1870US6468348B1Method of producing an open formINFINEON TECHNOLOGIES AG·Filed 2000·Granted Oct 22, 2002·7 cites·9 claims
- 1968US5306647AMethod for manufacturing a solar cell from a substrate waferSIEMENS AG·Filed 1992·Granted Apr 26, 1994·42 cites·20 claims
- 2067US10157765B2Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·17 claims
- 2166US9293371B2Method for processing a semiconductor workpiece with metallizationINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 22, 2016·1 cites·8 claims
- 2266US8013364B2Semiconductor devices and structures thereofINFINEON TECHNOLOGIES AG·Filed 2009·Granted Sep 6, 2011·2 cites·20 claims
- 2364US9093385B2Method for processing a semiconductor workpiece with metallizationINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 28, 2015·1 cites·26 claims
- 2464US6614575B1Optical structure and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2000·Granted Sep 2, 2003·10 cites·6 claims
- 2564US5866452AProcess for producing a silicon capacitorSIEMENS AG·Filed 1995·Granted Feb 2, 1999·23 cites·11 claims
- 2663US8148235B2Methods of manufacturing semiconductor devicesNAUJOK MARKUS·Filed 2009·Granted Apr 3, 2012·2 cites·46 claims
- 2761US9959890B2Magnetoresistive devices and methods for manufacturing magnetoresistive devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 1, 2018·0 cites·16 claims
- 2861US8058176B2Methods of patterning insulating layers using etching techniques that compensate for etch rate variationsPARK WAN-JAE·Filed 2007·Granted Nov 15, 2011·3 cites·4 claims
- 2961US5943571AMethod for manufacturing fine structuresSIEMENS AG·Filed 1997·Granted Aug 24, 1999·25 cites·5 claims
- 3060US6204119B1Manufacturing method for a capacitor in an integrated memory circuitSIEMENS AG·Filed 1999·Granted Mar 20, 2001·19 cites·10 claims
- 3158US7795135B2Method for producing a layer arrangementINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 14, 2010·2 cites·19 claims
- 3258US6887437B1Reactor configuration and method for producing itINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 3, 2005·3 cites·8 claims
- 3357US9570099B2Magnetoresistive devices and methods for manufacturing magnetoresistive devicesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 14, 2017·0 cites·23 claims
- 3456US6117790AMethod for fabricating a capacitor for a semiconductor memory configurationSIEMENS AG·Filed 1999·Granted Sep 12, 2000·16 cites·13 claims
- 3555US5177582ACMOS-compatible bipolar transistor with reduced collector/substrate capacitance and process for producing the sameSIEMENS AG·Filed 1991·Granted Jan 5, 1993·17 cites·5 claims
- 3655US2015084196A1Devices Formed With Dual Damascene ProcessINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 3754US6022786AMethod for manufacturing a capacitor for a semiconductor arrangementSIEMENS AG·Filed 1998·Granted Feb 8, 2000·15 cites·13 claims
- 3854US5347696AMethod for manufacturing a multi-layer capacitorSIEMENS AG·Filed 1993·Granted Sep 20, 1994·15 cites·17 claims
- 3953US7045070B1Method of producing an electrode configuration and method of electrically contacting the electrode configurationINFINEON TECHNOLOGIES AG·Filed 2000·Granted May 16, 2006·4 cites·16 claims
- 4052US8860225B2Devices formed with dual damascene processRIESS PHILIPP·Filed 2011·Granted Oct 14, 2014·0 cites·30 claims
- 4152US6140177AProcess of forming a semiconductor capacitor including forming a hemispherical grain statistical mask with silicon and germaniumSIEMENS AG·Filed 1997·Granted Oct 31, 2000·13 cites·5 claims
- 4252US5817553AProcess for manufacturing capacitors in a solid state configurationSIEMENS AG·Filed 1996·Granted Oct 6, 1998·12 cites·6 claims
- 4350US5500385AMethod for manufacturing a silicon capacitor by thinningSIEMENS AG·Filed 1995·Granted Mar 19, 1996·15 cites·9 claims
- 4449US2015147850A1Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 4548US6495415B2Method for fabricating a patterned layerINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 17, 2002·3 cites·25 claims
- 4648US5964652AApparatus for the chemical-mechanical polishing of wafersSIEMENS AG·Filed 1997·Granted Oct 12, 1999·13 cites·9 claims
- 4746US7883987B2Semiconductor devices and methods of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2010·Granted Feb 8, 2011·0 cites·20 claims
- 4846US2009087992A1Method of minimizing via sidewall damages during dual damascene trench reactive ion etching in a via first schemeCHARTERED SEMICONDUCTOR MFG·Filed 2007·Application pending·0 cites
- 4944US7906426B2Method of controlled low-k via etch for Cu interconnectionsGLOBALFOUNDRIES SG PTE LTD·Filed 2007·Granted Mar 15, 2011·0 cites·17 claims
- 5042US6670668B2Microelectronic structure, method for fabricating it and its use in a memory cellINFINEON TECHNOLOGIES AG·Filed 2001·Granted Dec 30, 2003·1 cites·8 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →