Inventor · disambiguated record
Munehide Saimen
Also filed as: SAIMEN MUNEHIDE
26 granted patents·2 pending applications·36 citations·filing 2004–2017
93Inventor score
Top patents by PatentIndex Score
28 records- 0189US9770907B2MEMS device, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2016·Granted Sep 26, 2017·3 cites·6 claims
- 0281US8289492B2Electro-optical device and electronic apparatusSAIMEN MUNEHIDE·Filed 2010·Granted Oct 16, 2012·6 cites·8 claims
- 0378US9969162B2MEMS device, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted May 15, 2018·1 cites·12 claims
- 0478US8391020B2Electro-optical device, electro-optical panel, and electronic apparatusSAIMEN MUNEHIDE·Filed 2010·Granted Mar 5, 2013·3 cites·13 claims
- 0577US8016181B2Method of producing electro-optical device using anisotropic conductive adhesive containing conductive particles to bond terminal portions and electro-optical deviceSEIKO EPSON CORP·Filed 2009·Granted Sep 13, 2011·7 cites·2 claims
- 0676US9914301B2Piezoelectric device, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Mar 13, 2018·1 cites·20 claims
- 0769US7535108B2Electronic component including reinforcing memberSEIKO EPSON CORP·Filed 2005·Granted May 19, 2009·4 cites·13 claims
- 0868US8675372B2Electrooptic substrate, electrooptic device, and electronic apparatusSAIMEN MUNEHIDE·Filed 2012·Granted Mar 18, 2014·1 cites·6 claims
- 0964US10029459B2Piezoelectric device, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Jul 24, 2018·0 cites·6 claims
- 1061US9844939B2Piezoelectric device, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Dec 19, 2017·0 cites·12 claims
- 1158US9684197B2Electro-optic device and electronic apparatusSEIKO EPSON CORP·Filed 2014·Granted Jun 20, 2017·0 cites·24 claims
- 1257US7656026B2Semiconductor deviceSEIKO EPSON CORP·Filed 2008·Granted Feb 2, 2010·3 cites·5 claims
- 1356US10377134B2MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing methodSEIKO EPSON CORP·Filed 2017·Granted Aug 13, 2019·0 cites·18 claims
- 1454US9908331B2MEMS device and liquid ejecting headSEIKO EPSON CORP·Filed 2017·Granted Mar 6, 2018·0 cites·10 claims
- 1552US7704793B2Electronic part and method for manufacturing the sameSEIKO EPSON CORP·Filed 2008·Granted Apr 27, 2010·0 cites·3 claims
- 1652US2008178723A1Semiconductor device manufacturing method and manufacturing apparatusSAIMEN MUNEHIDE·Filed 2007·Application pending·0 cites
- 1750US7582955B2Semiconductor device manufacturing method and manufacturing apparatusSEIKO EPSON CORP·Filed 2007·Granted Sep 1, 2009·0 cites·3 claims
- 1850US2009208731A1Conductive adhesive film, method of producing conductive adhesive film, electronic apparatus including conductive adhesive film, and method of producing electronic apparatus including conductive adhesive filmSEIKO EPSON CORP·Filed 2009·Application pending·0 cites
- 1949US8640582B2Method for manufacturing flexible substrate and flexible substrate punching deviceSAIMEN MUNEHIDE·Filed 2009·Granted Feb 4, 2014·0 cites·4 claims
- 2049US7190065B2Circuit substrate, semiconductor module and method of manufacturing circuit substrateSEIKO EPSON CORP·Filed 2004·Granted Mar 13, 2007·3 cites·5 claims
- 2148US7348679B2Electronic part having reinforcing memberSEIKO EPSON CORP·Filed 2005·Granted Mar 25, 2008·0 cites·7 claims
- 2248US7316939B2Semiconductor device manufacturing method and manufacturing apparatusSEIKO EPSON CORP·Filed 2004·Granted Jan 8, 2008·2 cites·15 claims
- 2347US9919523B2Piezoelectric device, liquid ejecting head, and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2017·Granted Mar 20, 2018·0 cites·18 claims
- 2447US7385142B2Manufacturing method of electronic part and wiring substrateSEIKO EPSON CORP·Filed 2005·Granted Jun 10, 2008·0 cites·9 claims
- 2546US7390733B2Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrodeSEIKO EPSON CORP·Filed 2004·Granted Jun 24, 2008·2 cites·2 claims
- 2644US7901528B2Method for manufacturing wiring substrate having sheetSEIKO EPSON CORP·Filed 2007·Granted Mar 8, 2011·0 cites·12 claims
- 2742US7323365B2Semiconductor device manufacturing method and manufacturing apparatusSEIKO EPSON CORP·Filed 2004·Granted Jan 29, 2008·0 cites·12 claims
- 2839US7282389B2Semiconductor device manufacturing method and manufacturing apparatusSEIKO EPSON CORP·Filed 2004·Granted Oct 16, 2007·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Munehide Saimen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →