Inventor · disambiguated record
Sangdo Lee
Also filed as: LEE SANGDO
2 granted patents·2 pending applications·15 citations·filing 2006–2011
56Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0180US7564124B2Semiconductor die package including stacked dice and heat sink structuresFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Jul 21, 2009·13 cites·28 claims
- 0248US8084870B2Semiconductor devices and electrical parts manufacturing using metal coated wiresLEE SANGDO·Filed 2007·Granted Dec 27, 2011·2 cites·5 claims
- 0333US2007222087A1Semiconductor device with solderable loop contactsLEE SANGDO·Filed 2007·Application pending·0 cites
- 0432US2012146204A1Semiconductor devices and electrical parts manufacturing using metal coated wiresLEE SANGDO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →