Inventor · disambiguated record
Yan-Fu Lin
Also filed as: Lin yan-fu
10 granted patents·2 pending applications·136 citations·filing 2010–2025
89Inventor score
Top patents by PatentIndex Score
12 records- 0198US10163802B2Fan-out package having a main die and a dummy die, and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·76 cites·20 claims
- 0297US10510674B2Fan-out package having a main die and a dummy die, and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·20 cites·20 claims
- 0395US11967563B2Fan-out package having a main die and a dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 23, 2024·2 cites·20 claims
- 0495US9812426B1Integrated fan-out package, semiconductor device, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·19 cites·20 claims
- 0594US2025364427A1Fan-Out Package Having a Main Die and a Dummy DieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0692US11094641B2Fan-out package having a main die and a dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·4 cites·20 claims
- 0787US12224247B2Fan-out package having a main die and a dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 11, 2025·0 cites·20 claims
- 0887US8922004B2Copper bump structures having sidewall protection layersLIN JING-CHENG·Filed 2010·Granted Dec 30, 2014·9 cites·20 claims
- 0980US2025183191A1Fan-Out Package Having a Main Die and a Dummy DieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1076US9093314B2Copper bump structures having sidewall protection layersTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 28, 2015·3 cites·20 claims
- 1167US8629568B2Semiconductor device cover markLin yan-fu·Filed 2010·Granted Jan 14, 2014·3 cites·10 claims
- 1241US9852957B2Testing, manufacturing, and packaging methods for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →