Inventor · disambiguated record
Lan Shi
Also filed as: SHI LAN
2 granted patents·32 citations·filing 2002–2019
55Inventor score
Top patents by PatentIndex Score
2 records- 0182US6742694B2Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatusHITACHI GLOBAL STORAGE TECH·Filed 2002·Granted Jun 1, 2004·32 cites·3 claims
- 0262US11193845B2Ultrahigh sensitive pressure-sensing film based on spiky hollow carbon spheres and the fabrication method thereofUNIV FUDAN·Filed 2019·Granted Dec 7, 2021·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →