Inventor · disambiguated record
Ya-Yi Lai
Also filed as: LAI YA-YI
5 granted patents·1 pending application·47 citations·filing 2000–2016
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0178US9524944B2Method for fabricating package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Dec 20, 2016·4 cites·9 claims
- 0272US7019389B2Lead frame and semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Mar 28, 2006·23 cites·20 claims
- 0364US6414379B1Structure of disturbing plate having down setSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jul 2, 2002·17 cites·8 claims
- 0445US6642735B2Semiconductor package for chip with testing contact pad connected to outsideSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 4, 2003·3 cites·16 claims
- 0539US9362245B2Package structure and fabrication method thereofYEH CHUN-WEI·Filed 2013·Granted Jun 7, 2016·0 cites·10 claims
- 0633US2002109222A1Multi-die integrated circuit package structure and method of manufacturing the sameFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →