Inventor · disambiguated record
Tomoo Iwade
Also filed as: IWADE TOMOO
2 granted patents·1 pending application·25 citations·filing 2006–2020
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0186US8537551B2Semiconductor device including semiconductor packages stacked on one anotherIDE SHIGEO·Filed 2011·Granted Sep 17, 2013·15 cites·5 claims
- 0277US7728413B2Resin mold type semiconductor deviceDENSO CORP·Filed 2006·Granted Jun 1, 2010·10 cites·11 claims
- 0353US2020211954A1Semiconductor moduleDENSO CORP·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →