Inventor · disambiguated record
Jar-Dar Yang
Also filed as: YANG JAR-DAR
3 granted patents·1 pending application·14 citations·filing 2011–2012
66Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0188US8269352B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·10 cites·13 claims
- 0268US8269351B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·2 cites·11 claims
- 0368US8264068B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 11, 2012·2 cites·9 claims
- 0432US2013069228A1Flip-chip package structure and forming method thereofLIU AN-HONG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →