Inventor · disambiguated record
Tsung-Hsien Hsu
Also filed as: HSU TSUNG-HSIEN
5 granted patents·3 pending applications·22 citations·filing 2008–2014
74Inventor score
Top patents by PatentIndex Score
8 records- 0184US8963299B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Feb 24, 2015·8 cites·22 claims
- 0280US8766416B2Semiconductor package and fabrication method thereofHSU TSUNG-HSIEN·Filed 2012·Granted Jul 1, 2014·9 cites·9 claims
- 0364US8872779B2Method and software for testing touch panelsCHEN CHUN-NAN·Filed 2012·Granted Oct 28, 2014·3 cites·17 claims
- 0462US9257394B2Shield, package structure and semiconductor package having the shield and fabrication method of the semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Feb 9, 2016·2 cites·20 claims
- 0554US2014203771A1Electronic package, fabrication method thereof and adhesive compoundSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 0647US9490219B2Semiconductor package with shielding member and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 8, 2016·0 cites·16 claims
- 0736US2009251878A1Electronic Assembly and Method for Making Electronic DevicesHSU TSUNG-HSIEN·Filed 2008·Application pending·0 cites
- 0835US2014264958A1Semiconductor package, fabrication method thereof and molding compoundSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →