Inventor · disambiguated record
Katsumi Nomura
Also filed as: NOMURA KATSUMI
20 granted patents·9 pending applications·655 citations·filing 1980–2010
95Inventor score
Files withHITACHI CABLE17SHARP KK6SEMICONDUCTOR ENERGY LAB2MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1MUROGA TAKEMI1
Top patents by PatentIndex Score
29 records- 0194US5696003AMethod for fabricating a semiconductor device using a catalyst introduction regionSHARP KK·Filed 1994·Granted Dec 9, 1997·216 cites·36 claims
- 0292US5821562ASemiconductor device formed within asymetrically-shaped seed crystal regionSHARP KK·Filed 1995·Granted Oct 13, 1998·131 cites·59 claims
- 0391US5629787AMethod for producing an LCD by pressing the substratesSHARP KK·Filed 1995·Granted May 13, 1997·96 cites·16 claims
- 0490US7108923B1Copper foil for printed circuit board with taking environmental conservation into considerationHITACHI CABLE·Filed 2005·Granted Sep 19, 2006·11 cites·10 claims
- 0589US5499127ALiquid crystal display device having a larger gap between the substrates in the display area than in the sealant areaSHARP KK·Filed 1993·Granted Mar 12, 1996·79 cites·3 claims
- 0685US5677749AMethod for producing an LCD having no spacers in the display area in which heating alleviates cell distortion or greater pressure is applied to the seal regionSHARP KK·Filed 1995·Granted Oct 14, 1997·65 cites·14 claims
- 0780US7344785B2Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating sameHITACHI CABLE·Filed 2005·Granted Mar 18, 2008·4 cites·8 claims
- 0873US6777713B2Irregular semiconductor film, having ridges of convex portionSEMICONDUCTOR ENERGY LAB·Filed 2002·Granted Aug 17, 2004·13 cites·8 claims
- 0972US7842397B2Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foilHITACHI CABLE·Filed 2006·Granted Nov 30, 2010·6 cites·3 claims
- 1072US7789977B2Rolled copper foil and manufacturing method thereofHITACHI CABLE·Filed 2007·Granted Sep 7, 2010·4 cites·10 claims
- 1165US7631828B2Level wound coil, method of manufacturing same, and package for sameHITACHI CABLE·Filed 2009·Granted Dec 15, 2009·3 cites·14 claims
- 1263US7549601B2Level wound coil mounted on pallet, and package for sameHITACHI CABLE·Filed 2006·Granted Jun 23, 2009·1 cites·10 claims
- 1361US4330778ADevice for detecting broken filaments in lampsTOKYO SHIBAURA ELECTRIC CO·Filed 1980·Granted May 18, 1982·19 cites·8 claims
- 1459US7703503B2Heat pipe heat exchanger and method of fabricating the sameHITACHI CABLE·Filed 2006·Granted Apr 27, 2010·1 cites·21 claims
- 1556US7015079B2Semiconductor film, semiconductor device, and method of manufacturing the same including adding metallic element to the amorphous semiconductor film and introducing oxygen after crystallizationSHARP KK·Filed 2004·Granted Mar 21, 2006·4 cites·18 claims
- 1652US2007187067A1Heat transfer tube and heat exchanger using sameHITACHI CABLE·Filed 2006·Application pending·0 cites
- 1749US2010291402A1Rolled copper foil and manufacturing method thereofMUROGA TAKEMI·Filed 2010·Application pending·0 cites
- 1849US2006272802A1Cooling plateHITACHI CABLE·Filed 2006·Application pending·0 cites
- 1947US7763393B2Fuel cell having electrode channel member with comb-teeth shapeHITACHI CABLE·Filed 2006·Granted Jul 27, 2010·0 cites·12 claims
- 2045US7141823B2Thin film transistor semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 2002·Granted Nov 28, 2006·2 cites·53 claims
- 2144US7594621B2Level wound coil, method of manufacturing same, and package for sameHITACHI CABLE·Filed 2006·Granted Sep 29, 2009·0 cites·7 claims
- 2244US7537177B2Level wound coil, method of manufacturing same, and package for sameHITACHI CABLE·Filed 2006·Granted May 26, 2009·0 cites·3 claims
- 2344US2007051442A1Copper alloy material and method of making sameHITACHI CABLE·Filed 2006·Application pending·0 cites
- 2442US2008057371A1Separator for Fuel Cell and Method for Producing SameHITACHI CABLE·Filed 2006·Application pending·0 cites
- 2542US2006154131A1Fuel cell separator and fabrication method thereof, and conductive corrosion-resistant metallic materialHITACHI CABLE·Filed 2005·Application pending·0 cites
- 2640US2006207307A1Method of feeding a pipe from level wound coil, package for level wound coil and packaging method for level wound coilHITACHI CABLE·Filed 2006·Application pending·0 cites
- 2737US2004235671A1Permanent current switch material and production method thereforFiled 2002·Application pending·0 cites
- 2834US2006243427A1Heat pipe heat sink and method for fabricating the sameHITACHI CABLE·Filed 2006·Application pending·0 cites
- 2918US6142307APacking system of electronic componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 7, 2000·0 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →