Inventor · disambiguated record
Vladimir Perelman
Also filed as: PERELMAN VLADIMIR · PERELMAN VLADIMIR EVSEEVICH
17 granted patents·5 pending applications·690 citations·filing 1995–2025
95Inventor score
Files withAMKOR TECHNOLOGY INC8MICROSOFT TECHNOLOGY LICENSING LLC5OBSHCHESTVO S OGRANICHENNOY OTVETSTVENNOSTYU “AVTOKLAVY VYSOKOGO DAVLENIYA I2ST AMAND ROGER D2AMKOR TECH SINGAPORE HOLDING PTE LTD1
Top patents by PatentIndex Score
22 records- 0198US7859119B1Stacked flip chip die assemblyAMKOR TECHNOLOGY INC·Filed 2008·Granted Dec 28, 2010·82 cites·18 claims
- 0297US7132753B1Stacked die assembly having semiconductor die overhanging supportAMKOR TECHNOLOGY INC·Filed 2005·Granted Nov 7, 2006·74 cites·19 claims
- 0397US6930378B1Stacked semiconductor die assembly having at least one supportAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 16, 2005·178 cites·49 claims
- 0496US8482134B1Stackable package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Jul 9, 2013·30 cites·4 claims
- 0596US7459776B1Stacked die assembly having semiconductor die projecting beyond supportAMKOR TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·43 cites·19 claims
- 0695US7071568B1Stacked-die extension support structure and method thereofAMKOR TECHNOLOGY INC·Filed 2004·Granted Jul 4, 2006·103 cites·25 claims
- 0792US7675180B1Stacked electronic component package having film-on-wire spacerAMKOR TECHNOLOGY INC·Filed 2006·Granted Mar 9, 2010·38 cites·19 claims
- 0888US7768135B1Semiconductor package with fast power-up cycle and method of making sameAMKOR TECHNOLOGY INC·Filed 2008·Granted Aug 3, 2010·15 cites·20 claims
- 0988US5767480AHole generation and lead forming for integrated circuit lead frames using laser machiningNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jun 16, 1998·116 cites·13 claims
- 1085US8072083B1Stacked electronic component package having film-on-wire spacerST AMAND ROGER D·Filed 2010·Granted Dec 6, 2011·10 cites·17 claims
- 1172US2025168147A1Security for computer systemsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2024·Application pending·0 cites
- 1264US9496210B1Stackable package and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Nov 15, 2016·1 cites·10 claims
- 1363US2025233895A1Using a requestor identity to enforce a security policy on a network connection that conforms to a shared-access communication protocolMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2025·Application pending·0 cites
- 1456US12244564B2Security for computer systemsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 1555US12294615B2Using a requestor identity to enforce a security policy on a network connection that conforms to a shared-access communication protocolMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted May 6, 2025·0 cites·20 claims
- 1655US12009343B1Stackable package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2016·Granted Jun 11, 2024·0 cites·18 claims
- 1749US2025217268A1Multiple simultaneous code debuggingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Application pending·0 cites
- 1847US8084868B1Semiconductor package with fast power-up cycle and method of making sameST AMAND ROGER D·Filed 2010·Granted Dec 27, 2011·0 cites·12 claims
- 1941US10821645B2Device for deformational processing of materials (variants)OBSHCHESTVO S OGRANICHENNOY OTVETSTVENNOSTYU “AVTOKLAVY VYSOKOGO DAVLENIYA I·Filed 2014·Granted Nov 3, 2020·0 cites·17 claims
- 2036US2015209994A1Method for forming long sheets out of plasticized materials and a device for implementing the sameGUBENKO LEV ANATOLYEVICH·Filed 2013·Application pending·0 cites
- 2136US2016101554A1Method for forming long hollow articles and device for implementing same (variants)OBSHCHESTVO S OGRANICHENNOY OTVETSTVENNOSTYU AVTOKLAVY VYSOKOGO DAVLENIYA I TEMPERATURY·Filed 2013·Application pending·0 cites
- 2235US10220560B2Device for extruding plasticized masses and plastic powdered materialsOBSHCHESTVO S OGRANICHENNOY OTVETSTVENNOSTYU “AVTOKLAVY VYSOKOGO DAVLENIYA I·Filed 2013·Granted Mar 5, 2019·0 cites·1 claims
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