Inventor · disambiguated record
Ying-Cheng Liu
Also filed as: LIU YING-CHENG
31 granted patents·9 pending applications·95 citations·filing 2015–2025
95Inventor score
Top patents by PatentIndex Score
40 records- 0198US9530778B1Semiconductor devices having metal gate and method for manufacturing semiconductor devices having metal gateUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 27, 2016·40 cites·11 claims
- 0298US9455227B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 27, 2016·23 cites·7 claims
- 0396US12029044B2Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Jul 2, 2024·1 cites·11 claims
- 0495US11849648B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Dec 19, 2023·2 cites·6 claims
- 0595US11063206B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jul 13, 2021·6 cites·6 claims
- 0692US10727397B1Magnetoresistive random access memory cellUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jul 28, 2020·5 cites·16 claims
- 0791US2025344611A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0889US12284812B2Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Apr 22, 2025·0 cites·9 claims
- 0989US12262647B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Mar 25, 2025·0 cites·5 claims
- 1088US11005030B2Magnetoresistive random access memoryUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 11, 2021·2 cites·9 claims
- 1187US12402540B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Aug 26, 2025·0 cites·5 claims
- 1286US11508904B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 22, 2022·1 cites·9 claims
- 1386US11387408B2Magnetoresistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jul 12, 2022·1 cites·6 claims
- 1485US12133474B2Magnetoresistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 29, 2024·0 cites·5 claims
- 1583US2025212420A1Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1682US11957064B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 9, 2024·0 cites·13 claims
- 1782US10910553B1Magnetoresistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Feb 2, 2021·1 cites·6 claims
- 1882US2025107454A1Magnetoresistive random access memoryUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1982US2025194436A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2079US11812669B2Magnetoresistive random access memory and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Nov 7, 2023·0 cites·5 claims
- 2179US11018184B2Magnetoresistive random access memory with particular shape of dielectric layerUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 25, 2021·1 cites·11 claims
- 2278US11139011B2Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 5, 2021·2 cites·7 claims
- 2378US9548239B2Method for fabricating contact plug in an interlayer dielectric layerUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 17, 2017·3 cites·7 claims
- 2477US11646069B2MRAM semiconductor structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted May 9, 2023·0 cites·10 claims
- 2577US9613969B2Semiconductor structure and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Apr 4, 2017·2 cites·6 claims
- 2676US9985020B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 29, 2018·2 cites·15 claims
- 2772US12201032B2Magnetoresistive random access memoryUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 14, 2025·0 cites·10 claims
- 2872US10672979B1Method for fabricating magnetoresistive random access memoryUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jun 2, 2020·1 cites·7 claims
- 2970US9831133B2Semiconductor devices having metal gate and method for manufacturing semiconductor devices having metal gateUNITED MICROELECTRONICS CORP·Filed 2016·Granted Nov 28, 2017·1 cites·8 claims
- 3068US12402325B2MRAM structure with contact plug protruding out of contact hole and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Aug 26, 2025·0 cites·8 claims
- 3167US9660042B1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 23, 2017·1 cites·19 claims
- 3256US10141263B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 27, 2018·0 cites·10 claims
- 3356US2020227473A1Mram structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 3455US9685337B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 20, 2017·0 cites·7 claims
- 3554US9941215B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Apr 10, 2018·0 cites·7 claims
- 3653US2025391782A1Semiconductor waferNOVATEK MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 3751US9859170B2Method of forming semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 2, 2018·0 cites·13 claims
- 3837US2017194212A1Semiconductor device and method for fabriacting the sameUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 3936US2017287843A1Semiconductor device having contact plugs with different interfacial layersUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 4034US2017047251A1Method of manufacturing a semiconductor device including forming a dielectric layer around a patterned etch maskUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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