Inventor · disambiguated record
Ken Takano
Also filed as: TAKANO KEN · TAKANO KEN-ICHI
32 granted patents·3 pending applications·348 citations·filing 1998–2018
97Inventor score
Files withTDK CORP13LINTEC CORP7MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7PANASONIC IP MAN CO LTD5PANASONIC CORP1
Top patents by PatentIndex Score
35 records- 0191US6729018B1Apparatus for mounting componentsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 4, 2004·44 cites·4 claims
- 0287US7180705B2Thin film magnetic head capable of reducing expansion and bending of a recording pattern, method of manufacturing the same and magnetic recording apparatusSAE MAGNETICS HK LTD·Filed 2003·Granted Feb 20, 2007·23 cites·14 claims
- 0383US6731474B2Thin film magnetic head and method of manufacturing the sameTDK CORP·Filed 2001·Granted May 4, 2004·17 cites·11 claims
- 0482US9786541B2Dicing sheet with protective film forming layer and chip fabrication methodLINTEC CORP·Filed 2012·Granted Oct 10, 2017·7 cites·10 claims
- 0580US7165318B2Components placing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 23, 2007·8 cites·4 claims
- 0680US6144530AMagnetic head apparatus with head IC chipTDK CORP·Filed 1998·Granted Nov 7, 2000·33 cites·12 claims
- 0778US6202288B1Method for manufacturing magnetic head suspension assembly with head IC chipTDK CORP·Filed 1999·Granted Mar 20, 2001·29 cites·28 claims
- 0877US7017261B2Component suction device, component mounting apparatus and component mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 28, 2006·20 cites·33 claims
- 0977US6725532B1Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 27, 2004·38 cites·27 claims
- 1075US9443750B2Dicing sheet with protective film-forming layer, and method for producing chipLINTEC CORP·Filed 2012·Granted Sep 13, 2016·3 cites·11 claims
- 1173US10259115B2Work devicePANASONIC IP MAN CO LTD·Filed 2016·Granted Apr 16, 2019·2 cites·9 claims
- 1269US6268980B1Magnetic head apparatus with head IC chipTDK CORP·Filed 1998·Granted Jul 31, 2001·28 cites·8 claims
- 1365US10826262B2Electronic equipment assembly apparatus and electronic equipment assembly methodPANASONIC IP MAN CO LTD·Filed 2017·Granted Nov 3, 2020·1 cites·12 claims
- 1464US11038314B2Electronic device assembling apparatusPANASONIC IP MAN CO LTD·Filed 2018·Granted Jun 15, 2021·1 cites·10 claims
- 1560US6707294B2Method and program for calculating reproduction track width of magnetoresistive effect headTDK CORP·Filed 2002·Granted Mar 16, 2004·4 cites·7 claims
- 1658US6700368B2Method and program for analyzing characteristics of a magnetic transducerTDK CORP·Filed 2002·Granted Mar 2, 2004·6 cites·13 claims
- 1757US7296344B2Apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 20, 2007·5 cites·8 claims
- 1857US6469868B2Thin film magnetic head having a nonmagnetic conductive layer and method of manufacturing sameTDK CORP·Filed 1999·Granted Oct 22, 2002·12 cites·10 claims
- 1957US6173485B1Method for manufacturing magnetic head apparatus with slider and suspensionTDK CORP·Filed 1998·Granted Jan 16, 2001·12 cites·21 claims
- 2056US6426853B1Magnetoresistive effect sensor, thin-film magnetic head and thin-film wafer with the thin-film magnetic headsTDK CORP·Filed 1999·Granted Jul 30, 2002·19 cites·13 claims
- 2155US6976304B2Components placing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 20, 2005·5 cites·10 claims
- 2253US6333828B1Magnetic disk unit with slider suspension assemblies and head IC chipsTDK CORP·Filed 1999·Granted Dec 25, 2001·10 cites·11 claims
- 2352US7051431B2Component mounting control methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 30, 2006·4 cites·9 claims
- 2448US10399306B2Protective film forming film, sheet for forming protective film, and inspection methodLINTEC CORP·Filed 2014·Granted Sep 3, 2019·0 cites·6 claims
- 2548US7027271B2Magnetoresistive device in a thin-film magnetic head and method of manufacturing same having particular electrode overlay configurationTDK CORP·Filed 2001·Granted Apr 11, 2006·4 cites·12 claims
- 2647US6270588B1Magnetoresistive effect sensor, thin-film magnetic head with the sensor and manufacturing method of the thin-film magnetic headTDK CORP·Filed 1999·Granted Aug 7, 2001·13 cites·6 claims
- 2746US2018244963A1Adhesive agent composition and adhesive sheetLINTEC CORP·Filed 2016·Application pending·0 cites
- 2845US10766142B2Electronic device manufacturing apparatus and electronic device manufacturing methodPANASONIC IP MAN CO LTD·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 2944US7907420B2Bare chip mounted structure and mounting methodPANASONIC CORP·Filed 2006·Granted Mar 15, 2011·0 cites·5 claims
- 3043US10804670B2Electronic equipment assembly apparatus and electronic equipment assembly methodPANASONIC IP MAN CO LTD·Filed 2017·Granted Oct 13, 2020·0 cites·20 claims
- 3141US8619510B1Method for measurement of magnetic field gradient of recording magnetic field generated by magnetic headTAKANO KEN-ICHI·Filed 2012·Granted Dec 31, 2013·0 cites·9 claims
- 3238US9754811B2Dicing sheet with protective film forming layer and method for producing chipLINTEC CORP·Filed 2013·Granted Sep 5, 2017·0 cites·18 claims
- 3338US2002036874A1Magnetoresistive device and method of manufacturing same and thin-film magnetic head and method of manufacturing sameTDK CORP·Filed 2001·Application pending·0 cites
- 3437US10190017B2Protective film-forming film and method of manufacturing semiconductor chip with protective filmLINTEC CORP·Filed 2015·Granted Jan 29, 2019·0 cites·4 claims
- 3532US2017025636A1Laminated sheet for sealing electronic elements and production method for electronic devicesLINTEC CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →