Inventor · disambiguated record

Takashi Shimane

Also filed as: SHIMANE TAKASHI

1 granted patent·1 pending application·1 citations·filing 2002–2006

15Inventor score

Technology areasH10P H10W

Files withNEC ELECTRONICS CORP1

Top patents by PatentIndex Score

2 records

0151US7786005B2Method for manufacturing semiconductor device to form a via holeNEC ELECTRONICS CORP·Filed 2006·Granted Aug 31, 2010·1 cites·16 claims
0212US2003017256A1Applying apparatus and method of controlling film thickness for enabling uniform thicknessFiled 2002·Application pending·0 cites

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