Inventor · disambiguated record
Nelson Punzalan
Also filed as: PUNZALAN JR NELSON V · PUNZALAN NELSON · PUNZALAN NELSON V · PUNZALAN NELSON V JR
3 granted patents·4 pending applications·81 citations·filing 2004–2006
70Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0188US7378726B2Stacked packages with interconnecting pinsINTEL CORP·Filed 2005·Granted May 27, 2008·59 cites·20 claims
- 0263US7235870B2Microelectronic multi-chip modulePUNZALAN JR NELSON V·Filed 2004·Granted Jun 26, 2007·22 cites·14 claims
- 0343US7750450B2Stacked die package with stud spacersINTEL CORP·Filed 2006·Granted Jul 6, 2010·0 cites·11 claims
- 0438US2008079174A1Substrate slot design for die stack packagingPUNZALAN NELSON·Filed 2006·Application pending·0 cites
- 0537US2008157302A1Stacked-package quad flat null lead packageLEE SEUNGJU·Filed 2006·Application pending·0 cites
- 0633US2007135055A1Combination quad flat no-lead and thin small outline packageHO LEE S·Filed 2005·Application pending·0 cites
- 0727US2006108676A1Multi-chip package using an interposerPUNZALAN NELSON V JR·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →