Inventor · disambiguated record
Reiji Niino
Also filed as: NIINO REIJI
21 granted patents·1 pending application·911 citations·filing 1991–2020
95Inventor score
Top patents by PatentIndex Score
22 records- 0198US8778815B2Film forming methodTOKYO ELECTRON LTD·Filed 2013·Granted Jul 15, 2014·72 cites·4 claims
- 0297US5637153AMethod of cleaning reaction tube and exhaustion piping system in heat processing apparatusTOKYO ELECTRON LTD·Filed 1995·Granted Jun 10, 1997·351 cites·16 claims
- 0396US5252133AVertically oriented CVD apparatus including gas inlet tube having gas injection holesTOSHIBA KK·Filed 1991·Granted Oct 12, 1993·313 cites·10 claims
- 0486US7989354B2Patterning methodTOKYO ELECTRON LTD·Filed 2008·Granted Aug 2, 2011·9 cites·30 claims
- 0585US5380370AMethod of cleaning reaction tubeTOKYO ELECTRON LTD·Filed 1993·Granted Jan 10, 1995·56 cites·8 claims
- 0680US10446438B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2018·Granted Oct 15, 2019·2 cites·8 claims
- 0780US8168375B2Patterning methodNAKAJIMA SHIGERU·Filed 2008·Granted May 1, 2012·9 cites·25 claims
- 0877US10960435B2Film forming apparatus, film forming method, and storage mediumTOKYO ELECTRON LTD·Filed 2018·Granted Mar 30, 2021·2 cites·7 claims
- 0974US5316472AVertical boat used for heat treatment of semiconductor wafer and vertical heat treatment apparatusTOKYO ELECTRON LTD·Filed 1992·Granted May 31, 1994·66 cites·24 claims
- 1073US8383522B2Micro pattern forming methodTOKYO ELECTRON LTD·Filed 2011·Granted Feb 26, 2013·2 cites·18 claims
- 1171US10593556B2Method of fabricating semiconductor device, vacuum processing apparatus and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2017·Granted Mar 17, 2020·1 cites·6 claims
- 1268US7754622B2Patterning method utilizing SiBN and photolithographyTOKYO ELECTRON LTD·Filed 2008·Granted Jul 13, 2010·2 cites·11 claims
- 1365US11056349B2Method of fabricating semiconductor device, vacuum processing apparatus and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jul 6, 2021·0 cites·4 claims
- 1459US10755971B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2019·Granted Aug 25, 2020·0 cites·9 claims
- 1554US5500388AHeat treatment process for wafersTOKYO ELECTRON LTD·Filed 1994·Granted Mar 19, 1996·26 cites·13 claims
- 1650US10790135B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2018·Granted Sep 29, 2020·0 cites·8 claims
- 1750US10629448B2Method of manufacturing semiconductor device and vacuum processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Apr 21, 2020·0 cites·6 claims
- 1849US10748782B2Method of manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2018·Granted Aug 18, 2020·0 cites·10 claims
- 1948US10490405B2Semiconductor device manufacturing method, substrate processing apparatus and vacuum processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Nov 26, 2019·0 cites·10 claims
- 2047US2009311634A1Method of double patterning using sacrificial structureTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2144US11136668B2Film-forming apparatus and film-forming methodTOKYO ELECTRON LTD·Filed 2019·Granted Oct 5, 2021·0 cites·4 claims
- 2244US9162252B2Film forming methodTOKYO ELECTRON LTD·Filed 2013·Granted Oct 20, 2015·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →