Inventor · disambiguated record
Wei Qun Peng
Also filed as: PENG WEI QUN
1 granted patent·3 pending applications·36 citations·filing 2007–2011
48Inventor score
Top patents by PatentIndex Score
4 records- 0190US7939939B1Stable gold bump solder connectionsTEXAS INSTRUMENTS INC·Filed 2007·Granted May 10, 2011·36 cites·4 claims
- 0245US2011177686A1Stable Gold Bump Solder ConnectionsTEXAS INSTRUMENTS INC·Filed 2011·Application pending·0 cites
- 0340US2008083993A1Gold-Tin Solder Joints Having Reduced EmbrittlementTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 0428US2012001336A1Corrosion-resistant copper-to-aluminum bondsZENG KEJUN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →