Inventor · disambiguated record
Takuya Komeda
Also filed as: KOMEDA TAKUYA
3 granted patents·1 pending application·6 citations·filing 2014–2024
58Inventor score
Top patents by PatentIndex Score
4 records- 0186US10138558B2Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using sameUEMURA KOGYO KK·Filed 2016·Granted Nov 27, 2018·3 cites·6 claims
- 0273US9374913B2Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using sameUYEMURA C & CO LTD·Filed 2014·Granted Jun 21, 2016·3 cites·4 claims
- 0356US12503775B2Copper etching solutionUEMURA KOGYO KK·Filed 2022·Granted Dec 23, 2025·0 cites·10 claims
- 0453US2024351943A1Method of producing plating depositUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →